5SGXMA9K3H40C2LG

The 5SGXMA9K3H40C2LG is a Stratix® V GX Field Programmable Gate Array (FPGA) IC in a 1517-BBGA FCBGA package. It delivers very high logic density and a large I/O count for commercial-temperature applications.

Designed for high-density programmable logic and complex system integration, this device combines 840,000 logic elements with substantial on-chip RAM and extensive I/O to address demanding digital designs and high-bandwidth interface development.

Key Features

• Core Logic  840,000 logic elements (cells) provide extensive programmable fabric to implement complex digital functions and large-scale state machines.
• Embedded Memory  Approximately 53.2 Mbits of on-chip RAM (53,248,000 bits) for high-capacity buffering, FIFOs, and local storage.
• I/O and Periphery  696 dedicated I/O pins support dense external connectivity for multi-channel interfaces and parallel buses.
• Transceiver Capability (Series-Level)  Stratix V GX devices in the series support high-speed transceiver channels; refer to series datasheet for speed-grade details and channel options.
• Power  Core voltage range of 820 mV to 880 mV enables precise core power management per device requirements.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45). Surface-mount mounting type for standard PCB assembly.
• Temperature Grade  Commercial grade operation with an operating temperature from 0 °C to 85 °C.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free assembly.

Typical Applications

• High-density digital systems  Use the large logic capacity and embedded RAM for compute acceleration, complex control logic, and custom datapath implementations.
• High-bandwidth interface development  Abundant I/O and series-level GX transceiver support make this part suitable for prototyping and deploying multi-channel, high-speed serial links and parallel interfaces.
• Multi-I/O systems and aggregation  With 696 I/O pins, the device is well suited for applications requiring extensive external connectivity such as data aggregation, switching fabrics, and complex peripheral interfacing.

Unique Advantages

• High logic density: 840,000 logic elements enable implementation of large-scale, integrated FPGA designs without partitioning across multiple devices.
• Substantial on-chip RAM: Approximately 53.2 Mbits of embedded memory reduces external memory dependence and improves data locality for low-latency designs.
• Extensive I/O resources: 696 I/O pins provide flexibility for complex board-level connectivity and parallel interface designs.
• Commercial temperature rating: Rated 0 °C to 85 °C for reliable operation in standard commercial environments.
• RoHS compliant: Facilitates lead-free manufacturing and regulatory compliance for modern electronics production.
• Dense BGA packaging: 1517-BBGA / 1517-HBGA (45×45) package supports compact board layouts while exposing high I/O counts.

Why Choose 5SGXMA9K3H40C2LG?

The 5SGXMA9K3H40C2LG positions itself as a high-density, commercial-grade Stratix V GX FPGA optimized for designs that need a combination of large logic capacity, sizeable on-chip memory, and a high number of external I/O. Its core voltage range and package options provide the electrical and mechanical foundation required for complex system integration.

This device is ideal for engineering teams implementing sophisticated digital systems, multi-interface aggregation, or development of high-bandwidth interfaces where series-level transceiver capabilities and abundant resources reduce the need for multi-device partitioning. The combination of density, memory, and I/O supports scalable designs and helps streamline BOM and board complexity.

Request a quote or submit an inquiry to receive pricing and availability information for 5SGXMA9K3H40C2LG and to discuss how this Stratix® V GX FPGA can be integrated into your next design.