5SGXMA9K2H40I3N

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA

Quantity 1,872 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMA9K2H40I3N – Stratix V GX FPGA, 840,000 logic elements, 696 I/Os

The 5SGXMA9K2H40I3N is a Stratix V GX Field Programmable Gate Array (FPGA) manufactured by Intel. It delivers a high-density programmable fabric with 840,000 logic elements and approximately 53.2 Mbits of embedded memory for complex digital designs.

Specified for industrial temperature operation and low-voltage core supply, this device targets industrial and enterprise-class applications that require large logic capacity, significant on-chip RAM, and a high I/O count in a compact surface-mount FCBGA package.

Key Features

  • Core Density  840,000 logic elements provide substantial programmable logic resources for large-scale integration and complex algorithms.
  • Embedded Memory  Approximately 53.2 Mbits of on-chip RAM to support large data buffering, packet processing, and state storage without external memory dependency.
  • I/O Capacity  696 I/Os to accommodate extensive peripheral connectivity and multi-lane interfaces within a single device.
  • Power and Core Voltage  Core supply range of 820 mV to 880 mV to match low-voltage system designs and optimized power domains.
  • Package & Mounting  1517-BBGA (FCBGA) supplier package (1517-HBGA, 45×45) with surface-mount mounting for compact board integration.
  • Operating Range  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
  • Environmental Compliance  RoHS compliant, supporting regulatory requirements for lead-free assemblies.

Unique Advantages

  • High logic capacity: 840,000 logic elements enable consolidation of large subsystems into a single FPGA, reducing board-level complexity.
  • Substantial on-chip memory: Approximately 53.2 Mbits of embedded RAM reduces dependence on external memory and improves system latency.
  • Extensive I/O count: 696 I/Os support multiple parallel interfaces and flexible pin assignments for complex connectivity needs.
  • Industrial-grade robustness: Rated for −40 °C to 100 °C operation, suitable for harsh or temperature-variable installations.
  • Low-voltage core operation: 820–880 mV supply accommodates low-power core designs and modern power-rail architectures.
  • Compact FCBGA packaging: 1517-BBGA (45×45) surface-mount package provides a high-pin-count solution in a space-efficient footprint.

Why Choose 5SGXMA9K2H40I3N?

This Stratix V GX FPGA combines very high logic density, abundant embedded memory, and a large I/O complement in an industrial-grade, surface-mount FCBGA package. It is well suited for designs that require substantial on-chip resources and reliable operation across a wide temperature range.

Manufactured by Intel and based on the Stratix V family, the 5SGXMA9K2H40I3N offers a compact, high-capacity programmable platform for teams looking to integrate complex digital functions while minimizing external component count.

Request a quote or submit an inquiry to check availability, pricing, and lead times for the 5SGXMA9K2H40I3N.

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