5SGXMA9K2H40I3N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,872 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMA9K2H40I3N – Stratix V GX FPGA, 840,000 logic elements, 696 I/Os
The 5SGXMA9K2H40I3N is a Stratix V GX Field Programmable Gate Array (FPGA) manufactured by Intel. It delivers a high-density programmable fabric with 840,000 logic elements and approximately 53.2 Mbits of embedded memory for complex digital designs.
Specified for industrial temperature operation and low-voltage core supply, this device targets industrial and enterprise-class applications that require large logic capacity, significant on-chip RAM, and a high I/O count in a compact surface-mount FCBGA package.
Key Features
- Core Density 840,000 logic elements provide substantial programmable logic resources for large-scale integration and complex algorithms.
- Embedded Memory Approximately 53.2 Mbits of on-chip RAM to support large data buffering, packet processing, and state storage without external memory dependency.
- I/O Capacity 696 I/Os to accommodate extensive peripheral connectivity and multi-lane interfaces within a single device.
- Power and Core Voltage Core supply range of 820 mV to 880 mV to match low-voltage system designs and optimized power domains.
- Package & Mounting 1517-BBGA (FCBGA) supplier package (1517-HBGA, 45×45) with surface-mount mounting for compact board integration.
- Operating Range Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
- Environmental Compliance RoHS compliant, supporting regulatory requirements for lead-free assemblies.
Unique Advantages
- High logic capacity: 840,000 logic elements enable consolidation of large subsystems into a single FPGA, reducing board-level complexity.
- Substantial on-chip memory: Approximately 53.2 Mbits of embedded RAM reduces dependence on external memory and improves system latency.
- Extensive I/O count: 696 I/Os support multiple parallel interfaces and flexible pin assignments for complex connectivity needs.
- Industrial-grade robustness: Rated for −40 °C to 100 °C operation, suitable for harsh or temperature-variable installations.
- Low-voltage core operation: 820–880 mV supply accommodates low-power core designs and modern power-rail architectures.
- Compact FCBGA packaging: 1517-BBGA (45×45) surface-mount package provides a high-pin-count solution in a space-efficient footprint.
Why Choose 5SGXMA9K2H40I3N?
This Stratix V GX FPGA combines very high logic density, abundant embedded memory, and a large I/O complement in an industrial-grade, surface-mount FCBGA package. It is well suited for designs that require substantial on-chip resources and reliable operation across a wide temperature range.
Manufactured by Intel and based on the Stratix V family, the 5SGXMA9K2H40I3N offers a compact, high-capacity programmable platform for teams looking to integrate complex digital functions while minimizing external component count.
Request a quote or submit an inquiry to check availability, pricing, and lead times for the 5SGXMA9K2H40I3N.

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