5SGXMA9K3H40C2LN

The 5SGXMA9K3H40C2LN is a high-density Stratix® V GX field programmable gate array from Intel, providing 840,000 logic elements and approximately 53.25 Mbits of embedded memory. Designed as a commercial‑grade, surface‑mount FCBGA device, it offers a high I/O count and a compact 1517‑BBGA package for system-level integration.

This device targets complex, high‑capacity digital designs that require substantial on‑chip logic and memory alongside large external connectivity. Key technical strengths include a wide I/O complement and a tightly specified core voltage range for predictable power design.

Key Features

• Core Logic 840,000 logic elements to implement large combinational and sequential designs without partitioning across multiple devices.
• Embedded Memory Approximately 53.25 Mbits of on‑chip RAM to support buffering, lookup tables, and data‑intensive processing.
• I/O Density 696 I/O pins to support extensive peripheral connectivity and multiple parallel interfaces.
• Power Supply Core voltage specified from 820 mV to 880 mV for precise power budgeting and regulator selection.
• Package & Mounting 1517‑BBGA (FCBGA) package; supplier package listed as 1517‑HBGA (45×45), surface‑mount capable for compact PCB layouts.
• Operating Range & Grade Commercial grade, with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS‑compliant to meet common environmental and regulatory requirements.

Typical Applications

• High‑capacity digital processing — Large logic and embedded memory make the device suitable for computationally intensive FPGA implementations and custom accelerators.
• High‑density I/O systems — 696 I/Os enable designs that require extensive external interfacing, parallel data lanes, or multiple peripheral connections.
• Network and communications infrastructure — High logic and memory capacity support protocol processing, packet handling, and custom networking functions.
• Video and imaging pipelines — On‑chip RAM and plentiful logic resources accommodate buffering, image processing, and real‑time data flow control.

Unique Advantages

• Highly integrated logic and memory: Combines 840,000 logic elements with approximately 53.25 Mbits of embedded RAM to reduce the need for external components.
• Extensive external connectivity: 696 I/Os simplify board‑level design when interfacing many sensors, transceivers, or parallel buses.
• Predictable power envelope: Specified core supply range (820 mV–880 mV) helps streamline power‑architecture design and regulator selection.
• Compact FCBGA packaging: 1517‑BBGA / 1517‑HBGA (45×45) enables dense system integration while remaining surface‑mount compatible.
• Commercial temperature grade: Rated 0 °C to 85 °C for standard commercial deployments.
• RoHS compliance: Supports common environmental requirements across global supply chains.

Why Choose 5SGXMA9K3H40C2LN?

The 5SGXMA9K3H40C2LN positions itself as a high‑capacity Stratix V GX FPGA option for designers who need substantial on‑chip logic, sizable embedded memory, and a large I/O footprint in a single commercial‑grade device. Its defined core voltage window and FCBGA packaging make it suitable for compact, high‑density systems where integration and predictable power behavior matter.

Manufactured by Intel and documented within the Stratix V family datasheet, this part is appropriate for teams building complex digital subsystems, custom accelerators, and high‑throughput interfaces that benefit from consolidated logic and memory resources.

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