5SGXMA9K3H40C2G

The 5SGXMA9K3H40C2G is a Stratix® V GX field-programmable gate array (FPGA) in a 1517-ball BGA package designed for high‑density system integration. This commercial‑grade device integrates a large fabric of logic resources and on‑chip memory alongside a high I/O count to support complex digital systems.

Typical use cases include high‑performance processing, protocol bridging, and system integration tasks where a combination of large logic capacity, substantial embedded memory, and many external interfaces is required. The device is specified with operating voltages and temperature range suitable for commercial applications and complies with RoHS.

Key Features

• Logic Capacity  840,000 logic elements for implementing large-scale digital logic and custom accelerators.
• Embedded Memory  Approximately 53 Mbits of on‑chip RAM to support buffering, FIFOs, and memory‑intensive functions without external SDRAM.
• I/O Density  696 I/Os to connect numerous peripherals, interfaces, and high‑pin‑count subsystems directly to the FPGA fabric.
• Package and Mounting  1517‑BBGA (supplier package 1517‑HBGA, 45×45) surface‑mount package for compact board integration.
• Power Supply  Core voltage range of 870 mV to 930 mV, enabling precise power sequencing and low‑voltage core operation.
• Commercial Temperature Grade  Rated for 0 °C to 85 °C operation to meet typical commercial environment requirements.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High‑Performance Data Processing  Large logic and embedded memory enable implementation of custom compute pipelines, packet processing, and hardware accelerators.
• Protocol Bridging and Interface Aggregation  High I/O count supports multiple interfaces and signal domains for bridging, aggregation, and system glue logic.
• Prototyping and System Integration  Dense logic and memory resources make the device suitable for validating complex SoC subsystems and integrating multiple functions onto a single FPGA.

Unique Advantages

• Large Logic Fabric: 840,000 logic elements provide the capacity to implement complex state machines, datapaths, and custom controllers without partitioning across multiple devices.
• Substantial On‑Chip Memory: Approximately 53 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs, simplifying board design.
• Extensive I/O Count: 696 I/Os allow direct connection to numerous external devices, sensors, or mezzanine cards, minimizing the need for additional bridging components.
• Compact BGA Package: The 1517‑BBGA package provides a high‑pin‑count solution in a compact footprint for space‑constrained designs.
• Designed for Commercial Systems: Commercial temperature rating and RoHS compliance make the device suitable for mainstream industrial, communications, and enterprise applications.

Why Choose 5SGXMA9K3H40C2G?

The 5SGXMA9K3H40C2G combines a high logic element count, significant embedded memory, and a very large number of I/Os in a compact BGA package to address demanding commercial applications that require integration and scalability. Its electrical and operating parameters are documented in the Stratix V device datasheet, supporting predictable integration into system power and thermal plans.

This device is appropriate for design teams building complex digital systems—such as data plane accelerators, protocol converters, and high‑density I/O controllers—who need a high‑capacity FPGA platform with commercial temperature support and RoHS compliance.

Request a quote or submit your procurement inquiry to learn more about availability, lead times, and options for integrating the 5SGXMA9K3H40C2G into your design.