5SGXMA9K3H40C2N

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA

Quantity 1,732 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMA9K3H40C2N – Stratix® V GX FPGA, 840,000 logic elements, 696 I/O

The 5SGXMA9K3H40C2N is a Stratix V GX field-programmable gate array (FPGA) from Intel, optimized for high-density logic and large embedded memory requirements. It delivers substantial on-chip resources—making it suitable for designs that require extensive programmable logic, abundant embedded RAM, and a high I/O count.

As a commercial-grade device in the Stratix V GX family, this package-level offering pairs a large logic fabric and memory capacity with a high pin-count ball-grid array package for surface-mount applications that need significant integration and system-level I/O.

Key Features

  • High Logic Capacity — 840,000 logic elements (logic cells) to support complex digital designs and substantial programmable logic integration.
  • Embedded Memory — Approximately 53.2 Mbits of on-chip RAM to support buffering, frame storage, and large state machines without external memory.
  • Extensive I/O — 696 device I/O pins, enabling broad system connectivity, high-speed interfaces, and complex board-level routing.
  • Power and Core Supply — Core supply voltage range of 870 mV to 930 mV, allowing precise power planning for the FPGA core domains.
  • Package and Mounting — 1517-BBGA (FCBGA) package, supplier package 1517-HBGA (45×45), in a surface-mount form factor for dense board layouts.
  • Commercial Temperature Grade — Rated for 0°C to 85°C operation for commercial applications and environments.
  • RoHS Compliant — Conforms to RoHS environmental standards for lead-free assembly and regulatory compliance.
  • Stratix V GX Family Transceiver Capabilities — The Stratix V GX family (to which this device belongs) includes transceiver speed grades documented up to 14.1 Gbps in some device grades, reflecting the family’s focus on high-speed serial connectivity.

Typical Applications

  • High-density digital systems — Use the large logic fabric and embedded RAM for complex FPGA-based processing, protocol handling, and custom logic consolidation.
  • High-throughput I/O interfaces — Leverage the 696 I/O pins for routing multiple high-speed interfaces, wide parallel buses, or extensive peripheral connectivity.
  • System integration and consolidation — Replace multiple discrete components by integrating functions into the FPGA fabric to reduce board-level complexity.

Unique Advantages

  • Large programmable resource pool: 840,000 logic elements provide headroom for complex algorithms, large state machines, and extensive custom logic.
  • Significant on-chip memory: Approximately 53.2 Mbits of embedded RAM reduces dependency on external memory for many buffering and data storage needs.
  • High pin-count package: 696 I/O pins and a 1517-BBGA (45×45 HBGA supplier package) enable dense system-level connectivity and flexible board designs.
  • Commercial temperature rating: Specified 0°C to 85°C operation suits a wide range of commercial applications and environments.
  • RoHS compliance: Facilitates lead-free manufacturing and meets common environmental requirements.

Why Choose 5SGXMA9K3H40C2N?

The 5SGXMA9K3H40C2N offers designers a high-capacity Stratix V GX FPGA option with a balance of extensive logic resources, substantial embedded memory, and broad I/O availability in a surface-mount BBGA package. It is positioned for commercial applications that demand significant programmable logic, on-chip RAM, and a high number of I/Os while maintaining RoHS compliance and a defined commercial temperature range.

Choose this device when your design requires scalability within a well-documented FPGA family, ample on-chip resources to reduce external components, and package-level options that support dense PCB integration.

If you would like pricing, availability, or a formal quote for the 5SGXMA9K3H40C2N, request a quote or submit an inquiry and our team will respond with the next steps.

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