5SGXMA9K3H40C2NCV

The 5SGXMA9K3H40C2NCV is a Stratix V GX field-programmable gate array (FPGA) in a high-density BGA package. It integrates 840,000 logic elements and approximately 53.25 Mbits of embedded memory to support complex logic, buffering, and on-chip data processing.

With 696 user I/Os, a surface-mount 1517-BBGA/1517-HBGA (45×45) package, and a 870 mV–930 mV core supply range, this commercial-grade device is configured for designs that require dense logic, substantial on-chip RAM, and broad I/O connectivity within a commercial temperature window (0°C to 85°C).

Key Features

• Core Logic  840,000 logic elements provide large-scale programmable logic capacity suitable for complex FPGA implementations.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support data buffering, FIFOs, and memory-intensive logic functions.
• High I/O Count  696 I/O pins for extensive external connectivity and parallel interface support.
• Package and Mounting  Available in 1517-BBGA (FCBGA) with supplier device package 1517-HBGA (45×45); surface-mount mounting for board-level integration.
• Power  Core voltage supply range of 870 mV to 930 mV to match system power-rail planning.
• Commercial Grade Temperature  Rated for 0°C to 85°C operation for commercial-environment deployments.
• Regulatory  RoHS-compliant.

Typical Applications

• High-density logic systems  Implements large logic meshes, state machines, and custom processing cores using 840,000 logic elements.
• Memory-intensive processing  Uses approximately 53.25 Mbits of embedded memory for on-chip buffering, packet queues, and data staging.
• High-I/O interface designs  Leverages 696 I/Os for wide parallel buses, multiple peripheral interfaces, or board-level interconnects.

Unique Advantages

• High programmable density: 840,000 logic elements enable implementation of large, integrated FPGA designs without external logic expansion.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependency on external memory for many buffering and processing tasks.
• Extensive connectivity: 696 I/Os accommodate complex peripheral arrays and multi-channel interface requirements.
• Compact BGA footprint: 1517-BBGA / 1517-HBGA (45×45) packaging provides a dense board-level solution for space-constrained designs.
• Controlled power envelope: Core supply range of 870 mV–930 mV supports integration into systems designed around low-voltage core rails.
• Commercial-environment ready: Rated for 0°C to 85°C operation and RoHS-compliant for standard commercial deployments.

Why Choose 5SGXMA9K3H40C2NCV?

This Stratix V GX FPGA balances very high logic capacity, substantial embedded memory, and a large I/O complement in a single commercial-grade package. It is appropriate for development teams and OEMs targeting complex, memory-heavy designs that require significant on-chip resources and broad external connectivity.

Choosing this device offers a compact, high-density option for systems that need to consolidate logic and buffering on-chip while maintaining standard commercial temperature operation and RoHS compliance.

Request a quote or submit a pricing inquiry to evaluate 5SGXMA9K3H40C2NCV for your next FPGA design.