5SGXMA9K3H40C4G

The 5SGXMA9K3H40C4G is an Intel Stratix V GX commercial-grade FPGA delivering large logic capacity and extensive I/O for complex digital designs. This device integrates 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and 696 I/O pins to support high-density logic, large on-chip memory requirements, and substantial external connectivity.

Packaged in a 1517-BBGA FCBGA (supplier package 1517-HBGA, 45×45) and rated for surface-mount assembly, the device operates over a commercial temperature range of 0°C to 85°C with a core supply window of 820 mV to 880 mV. It is RoHS compliant.

Key Features

• Core Logic 840,000 logic elements provide the capacity required for large FPGA implementations and complex custom logic functions.
• Embedded Memory Approximately 53.25 Mbits of on-chip RAM to support buffering, FIFOs, and embedded memory structures without external DRAM for many functions.
• I/O Count 696 I/O pins enable wide parallel interfaces, multi-channel connectivity, and high-pin-count system interfaces.
• Power Supply Core voltage support from 820 mV to 880 mV, allowing precise core-power budgeting and power-domain planning.
• Package & Assembly 1517-BBGA (FCBGA) package; supplier package listed as 1517-HBGA (45×45) for surface-mount PCB assembly.
• Temperature & Grade Commercial temperature grade specified for operation from 0°C to 85°C.
• Environmental Compliance RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High-density digital processing — Large logic capacity and substantial embedded RAM make this device suitable for complex signal processing blocks and algorithm acceleration.
• Multi-channel I/O systems — 696 I/O pins support designs requiring many parallel interfaces, multi-lane data aggregation, or wide bus connections.
• Prototyping and system integration — High logic and memory resources enable rapid prototyping of SoC functions and integration of multiple logic domains on a single device.

Unique Advantages

• Large programmable fabric — 840,000 logic elements reduce the need to partition designs across multiple FPGAs, simplifying interconnect and system design.
• Substantial on-chip memory — Approximately 53.25 Mbits of embedded RAM supports buffering and state storage without immediate reliance on external memory.
• Extensive external connectivity — 696 I/Os enable flexible interface options for high-pin-count systems and parallel data paths.
• Commercial temperature suitability — Rated for 0°C to 85°C for applications targeting commercial environments.
• Industry-standard package — 1517-BBGA/1517-HBGA (45×45) packaging supports surface-mount assembly practices for high-density boards.
• Regulatory compliance — RoHS compliance supports environmentally conscious manufacturing and supply-chain requirements.

Why Choose 5SGXMA9K3H40C4G?

The 5SGXMA9K3H40C4G combines high logic capacity, significant embedded memory, and a large I/O count in a commercial-grade Stratix V GX FPGA package. It is positioned for designers who need to consolidate complex digital functions, implement large on-chip memory structures, and connect many external signals without compromising package-level density.

Choose this device for projects where strong integration, scalable logic resources, and high I/O density are central to system architecture. Its package and electrical specifications support standard surface-mount production flows and commercial-temperature deployments, backed by Intel’s Stratix V device family documentation.

Request a quote or submit an inquiry to receive pricing and lead-time information for the 5SGXMA9K3H40C4G. Our team can provide availability and support details to help you evaluate this Stratix V GX FPGA for your design.