5SGXMA9K3H40I3LN

The 5SGXMA9K3H40I3LN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1517-ball BGA footprint. It provides very high logic density and substantial on-chip memory in a surface-mount package targeted at demanding, industrial-temperature applications.

With 840,000 logic elements and approximately 53.25 Mbits of embedded memory, this device is suited to designs that require large programmable logic capacity, extensive I/O, and operation across an extended temperature range.

Key Features

• Core Logic 840,000 logic elements for high-density programmable logic integration.
• Embedded Memory Approximately 53.25 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive processing.
• I/O Capacity 696 available I/Os to support complex interfacing and high-pin-count system requirements.
• Power Voltage supply range specified at 820 mV to 880 mV, enabling compatibility with low-voltage core power rails.
• Package & Mounting 1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45). Surface-mount mounting type for standard board assembly.
• Temperature & Grade Industrial grade device specified for operation from –40°C to 100°C.
• Environmental Compliance RoHS compliant.

Typical Applications

• High-density programmable logic systems — Designs requiring large numbers of logic elements and substantial embedded memory for complex algorithm implementation.
• I/O‑intensive platforms — Systems that need hundreds of I/Os for sensor arrays, multi-channel interfaces, or extensive peripheral integration.
• Industrial temperature electronics — Deployments that require reliable operation across an extended temperature range (–40°C to 100°C).

Unique Advantages

• Massive logic capacity: 840,000 logic elements enable integration of large subsystems and consolidate multiple discrete components into a single FPGA.
• Substantial on‑chip memory: Approximately 53.25 Mbits of embedded RAM reduces external memory requirements and supports data-intensive workloads.
• High I/O count: 696 I/Os provide flexibility for complex board-level connectivity and multi-channel designs.
• Industrial-grade operation: Rated for –40°C to 100°C, supporting robust performance in harsh environments.
• Standard surface-mount BGA footprint: 1517-ball BGA (45×45 supplier package) streamlines PCB layout for high-density systems.
• RoHS compliant: Meets common environmental requirements for modern electronics manufacturing.

Why Choose 5SGXMA9K3H40I3LN?

The 5SGXMA9K3H40I3LN positions itself as a high-density Stratix V GX FPGA option for engineers needing large programmable logic capacity, extensive on-chip memory, and a very high I/O count in a single surface-mount package. Its industrial temperature rating and RoHS compliance make it suitable for applications where environmental range and regulatory conformity matter.

Choose this device when your design demands consolidation of complex functions, significant embedded buffering, and broad interfacing capability while maintaining a compact BGA form factor.

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