5SGXMA9K3H40C4N

The 5SGXMA9K3H40C4N is a Stratix V GX field programmable gate array (FPGA) from Intel, delivered in a 1517-BBGA FCBGA package. It provides very high logic capacity, substantial on-chip memory, and a large I/O complement for demanding digital designs.

Designed for commercial-temperature applications, this device addresses designs that require large-scale programmable logic, significant embedded RAM, and high I/O density while operating from a low-voltage core supply.

Key Features

• Core & Logic  Approximately 840,000 logic elements and 317,000 logic array blocks (LABs/CLBs) to implement large-scale digital logic and complex datapaths.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM for buffering, lookup tables, and on-FPGA data storage.
• I/O Density  696 user I/Os to support broad peripheral connectivity and high-pin-count interfacing requirements.
• Power  Core supply voltage range of 820 mV to 880 mV, enabling operation at the device’s specified core operating point.
• Package & Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-HBGA (45×45), surface-mount mounting for high-density board designs.
• Temperature & Grade  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant for reduced hazardous substances in manufacturing.
• Stratix V GX Series Characteristics  As part of the Stratix V GX family, the series documentation describes commercial core and transceiver speed grade offerings for GX devices, providing design-level guidance for high-performance transceiver and core speed options.

Typical Applications

• High-performance compute and acceleration  Large logic capacity and substantial on-chip RAM make this device suitable for compute-intensive acceleration tasks and parallel processing implementations.
• Network and communications systems  High I/O count supports complex front-end interfaces and dense interconnect required in networking equipment and communications infrastructure.
• Digital signal processing  The combination of logic density and embedded memory supports DSP pipelines, buffering, and complex filtering algorithms.
• Custom SoC and platform prototyping  Ample resources enable integration of custom accelerators and peripheral controllers for platform-level prototyping and integration.

Unique Advantages

• High logic capacity: Approximately 840,000 logic elements provide the headroom for large, multi-function designs and deep pipeline implementations.
• Substantial on-chip memory: Roughly 53.25 Mbits of embedded RAM reduces external memory dependency and lowers design complexity for data-heavy functions.
• Extensive I/O availability: 696 I/Os simplify board-level connectivity and support high-channel-count interface requirements without needing additional multiplexing.
• Compact, manufacturable package: 1517-BBGA (45×45 FCBGA) surface-mount package supports high-density PCB layouts while remaining compatible with standard assembly flows.
• Commercial-grade operation: Specified for 0 °C to 85 °C use cases, matching many standard electronics applications and environments.
• Regulatory friendliness: RoHS compliance supports environmental and regulatory requirements for modern electronics manufacturing.

Why Choose 5SGXMA9K3H40C4N?

The 5SGXMA9K3H40C4N delivers a combination of very large programmable logic capacity, substantial embedded memory, and high I/O count in a compact FCBGA package from Intel’s Stratix V GX family. It is positioned for commercial applications that require significant on-chip resources and dense external connectivity while operating at a low core voltage.

Designers and procurement teams targeting large-scale FPGA implementations, platform prototyping, or data- and I/O-intensive systems will find this device suited to reduce external BOM complexity and consolidate functionality on a single high-density FPGA. The Stratix V series documentation further provides guidance on available core and transceiver speed grades for system-level planning.

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