5SGXMA9K3H40C3G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 840000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,913 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMA9K3H40C3G – Stratix® V GX Field Programmable Gate Array (FPGA), 840,000 logic elements
The 5SGXMA9K3H40C3G is an Intel Stratix® V GX-series FPGA supplied in a 1517-BBGA FCBGA package. It delivers a high-capacity programmable fabric with integrated on-chip memory and a large I/O complement suitable for demanding digital designs.
Designed for commercial-grade applications, this device combines substantial logic resources, approximately 53.248 Mbits of embedded memory, and high I/O density to support complex signal processing, protocol handling, and system integration tasks.
Key Features
- Core Logic — 840,000 logic elements and 317,000 LABs provide extensive programmable fabric for large, complex designs.
- Embedded Memory — Approximately 53.248 Mbits of on-chip RAM to support buffering, look-up tables, and on-chip data storage.
- I/O and Connectivity — 696 user I/Os to accommodate dense peripheral and board-level interfacing needs.
- Package and Mounting — 1517-BBGA (FCBGA) package, supplier device package 1517-HBGA (45×45), supplied as a surface-mount component for modern PCB assembly.
- Power — Core supply operating range 820 mV to 880 mV for precise core voltage management.
- Temperature and Grade — Commercial grade with an operating range of 0 °C to 85 °C for standard commercial environments.
- Standards Compliance — RoHS-compliant design.
- Stratix V GX Family Features — Part of the Stratix V GX series with device-level electrical and switching characteristics defined in the Stratix V device datasheet, including transceiver and I/O timing specifications.
Typical Applications
- High-performance signal processing — Large logic and memory capacity enable implementation of complex DSP kernels and data-path acceleration.
- High-density I/O interfacing — 696 I/Os support multi-channel sensor, control, and peripheral aggregation on a single device.
- Protocol and packet processing — On-chip RAM and extensive logic resources accommodate deep buffering and custom protocol engines.
Unique Advantages
- High integration density: 840,000 logic elements and 317,000 LABs reduce the need for multiple devices in large-scale designs.
- Substantial on-chip memory: Approximately 53.248 Mbits of embedded RAM supports complex buffering and stateful processing without external memory.
- Large I/O complement: 696 user I/Os simplify board-level routing and enable direct interfacing to many peripherals.
- Commercial-grade operating range: 0 °C to 85 °C supports standard commercial deployments while maintaining predictable performance.
- Compact system footprint: 1517-BBGA (45×45) FCBGA packaging provides a high pin-count solution in a compact surface-mount form factor.
- Standards-aligned design data: Electrical and switching characteristics are documented in the Stratix V device datasheet for design verification and system integration.
Why Choose 5SGXMA9K3H40C3G?
This Stratix® V GX FPGA balances large-scale programmable logic, significant on-chip memory, and extensive I/O to address demanding commercial designs that require substantial compute and interfacing capability. Its package, power range, and documented device characteristics support reliable integration into advanced digital systems.
Choose this device when your design requires a high-capacity FPGA fabric with abundant embedded RAM and a high pin count to consolidate functions and reduce board-level complexity while staying within commercial temperature requirements.
Request a quote or submit an inquiry for pricing and availability to begin integrating the 5SGXMA9K3H40C3G into your design.

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