5SGXMA9K3H40C3NCV

The 5SGXMA9K3H40C3NCV is a Stratix V GX field programmable gate array from Intel, offered in a 1517-BBGA FCBGA package. This commercial-grade FPGA provides a large logic fabric, extensive embedded memory, and a high I/O count for complex digital designs.

Designed for systems that require substantial on-chip resources and dense I/O connectivity, the device targets applications that benefit from high logic element counts, multi-megabit embedded RAM, and a compact surface-mount package.

Key Features

• Logic Capacity  Approximately 840,000 logic elements to implement large-scale digital designs and complex algorithms.
• Embedded Memory  Approximately 53.2 Mbits of on-chip RAM for buffering, data storage, and high-throughput data paths.
• I/O Count  696 I/O pins to support extensive peripheral, bus, and high-density connector interfaces.
• Power Supply  Core voltage supply range of 0.82–0.88 V to match system power-rail requirements.
• Package & Mounting  1517-BBGA (FCBGA) package; supplier device package listed as 1517-HBGA (45×45). Surface-mount mounting type for PCB integration.
• Temperature & Grade  Commercial grade with an operating temperature range of 0°C to 85°C suitable for standard commercial environments.
• Regulatory  RoHS compliant.

Typical Applications

• High‑density digital systems  Use the large logic element count and embedded RAM to implement complex data-processing pipelines and custom compute blocks.
• Interface and I/O aggregation  Leverage 696 I/Os for consolidating multiple peripheral interfaces, protocol bridging, and board-level signal routing.
• Packet processing and buffering  Use the multi-megabit on-chip RAM for packet buffering, queuing, and temporary data storage in networking or data acquisition designs.

Unique Advantages

• High integration density: Approximately 840k logic elements reduce external ASIC/PMIC requirements and simplify system-level partitioning.
• Significant on‑chip memory: Approximately 53.2 Mbits of embedded RAM enables large local buffers and reduces dependence on external memory subsystems.
• Extensive I/O resources: 696 I/O pins provide flexibility for dense connectivity and complex interface requirements without additional components.
• Compact surface‑mount package: 1517-BBGA / 1517-HBGA (45×45) footprint supports space-constrained PCB layouts while maintaining high resource density.
• Commercial temperature suitability: Rated 0°C to 85°C for deployment in standard commercial applications.
• RoHS compliant: Meets common environmental compliance requirements for commercial products.

Why Choose 5SGXMA9K3H40C3NCV?

The 5SGXMA9K3H40C3NCV delivers a combination of large logic capacity, multi-megabit embedded memory, and extensive I/O in a single commercial-grade Stratix V GX FPGA package. It is well suited to designs that require dense on-chip resources, significant buffering, and broad external connectivity while fitting into a compact surface-mount form factor.

As part of the Stratix V family from Intel, this device is a fit for engineering teams building complex digital systems that prioritize integration, on-chip RAM capacity, and I/O flexibility within commercial temperature ranges.

Request a quote or submit a pricing inquiry to learn about availability, lead times, and volume pricing for 5SGXMA9K3H40C3NCV.