5SGXMA9K3H40I3N

The 5SGXMA9K3H40I3N is an industrial-grade Stratix® V GX FPGA in a 1517-BBGA (FCBGA) package designed for high-density programmable logic applications. It delivers a large logic fabric and embedded memory combined with a high I/O count and low-voltage core operating range, suitable for designs that require substantial on-chip resources and robust thermal performance.

Targeted at systems that need large amounts of programmable logic and on-chip memory while operating across an extended temperature range, this device provides an integrated platform for complex, transceiver-capable designs within the Stratix V family.

Key Features

• High logic capacity — 840,000 logic elements to implement large-scale digital designs and complex state machines.
• Embedded memory — approximately 53.25 Mbits of on-chip RAM for buffering, look-up tables, and data storage close to logic.
• Large I/O count — 696 I/Os to support dense external interfacing and parallel bus connections.
• Transceiver-capable series — part of the Stratix V GX family; series documentation lists transceiver speed grades (series-level) up to 14.1 Gbps for GX channels in certain grades.
• Low-voltage core — rated supply voltage from 820 mV to 880 mV for the core domain.
• Industrial temperature range — specified operating temperature from −40 °C to 100 °C for reliable use in industrial environments.
• Package & mounting — 1517-BBGA (FCBGA) / supplier package 1517-HBGA (45×45) in a surface-mount form factor.
• RoHS compliant — conforms to RoHS requirements for lead-free manufacturing and environmental compatibility.

Typical Applications

• Transceiver-intensive systems — ideal for designs that leverage the Stratix V GX family’s transceiver capabilities for high-speed serial links (series-level transceiver grades are documented up to 14.1 Gbps).
• High-density logic integration — suited to complex programmable logic implementations that require up to 840,000 logic elements and substantial on-chip memory.
• Industrial embedded systems — designed for industrial temperature operation (−40 °C to 100 °C) and large I/O counts for control, monitoring, and interface tasks.

Unique Advantages

• High-capacity programmable fabric: 840,000 logic elements provide the headroom required for large finite-state machines, protocol stacks, and custom accelerators.
• Significant on-chip memory: approximately 53.25 Mbits of embedded RAM reduces external memory dependence and improves data locality for latency-sensitive paths.
• Extensive external connectivity: 696 I/Os enable broad peripheral integration and support for wide parallel buses or many serial interfaces.
• Industrial-rated operation: −40 °C to 100 °C operating range supports deployment in demanding temperature environments.
• Low-voltage core compatibility: 820 mV–880 mV supply range aligns with modern low-voltage system designs, aiding power-optimized implementations.
• Production-friendly package: 1517-BBGA (FCBGA) surface-mount package in a 45×45 supplier format for system-level assembly and thermal handling.

Why Choose 5SGXMA9K3H40I3N?

The 5SGXMA9K3H40I3N positions itself as a high-density, industrial-grade Stratix V GX FPGA that brings large programmable logic capacity, substantial embedded memory, and a high I/O count into a single FCBGA package. Its combination of on-chip resources and industrial temperature rating makes it appropriate for complex systems requiring robust operation and significant local memory.

This device is well suited to engineering teams designing transceiver-capable, logic-dense systems that need scalability, integration, and adherence to industrial environmental ranges. Its specification set supports long-term deployments where on-chip resources and I/O density reduce BOM complexity and simplify board-level integration.

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