5SGXMA9K3H40I4G

The 5SGXMA9K3H40I4G is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1517-BBGA FCBGA package. It delivers a high-density fabric with 840,000 logic elements and approximately 53.248 Mbits of embedded memory, targeted for complex, high-performance digital and high-speed I/O designs.

Built for industrial operating conditions, this device combines large on-chip memory, extensive I/O capacity, and Stratix V GX transceiver capability as documented for the Stratix V family, enabling designs that require significant integration and high-speed serial channels.

Key Features

• Core Density — 840,000 logic elements for complex digital designs and deep logic integration.
• Embedded Memory — Approximately 53.248 Mbits of on-chip RAM to support large buffering, packet processing, and state storage.
• I/O Capacity — 696 general-purpose I/O pins to support broad peripheral and interconnect requirements.
• Transceiver Capability (Stratix V GX) — Series documentation lists GX transceiver speed grades (including channels up to 14.1 Gbps), consistent with the Stratix V GX device family.
• Power — Core supply range of 820 mV to 880 mV to match system power-rail design and power-management strategies.
• Package & Mounting — 1517-BBGA FCBGA package (supplier device package referenced as 1517-HBGA, 45×45) with surface-mount assembly for high-density board integration.
• Operating Temperature — Industrial temperature grade rated from −40 °C to 100 °C for deployment in demanding environments.
• Regulatory Status — RoHS compliant.

Typical Applications

• High-speed serial systems — Designs leveraging Stratix V GX transceivers for multi-gigabit channel implementation as documented for the Stratix V family.
• Network and packet processing — On-chip memory and high logic density enable buffering, parsing, and packet-forwarding functions.
• High-density I/O platforms — Large I/O count supports complex peripheral interfacing and board-level connectivity.

Unique Advantages

• High logic integration: 840,000 logic elements reduce the need for multiple devices when consolidating complex functions.
• Substantial embedded memory: Approximately 53.248 Mbits of on-chip RAM supports large buffers and local data storage without external memory for many use cases.
• Extensive I/O resources: 696 I/O pins provide flexibility for parallel interfaces, control signals, and system expansion.
• Industrial operating range: −40 °C to 100 °C rating supports deployment in temperature-challenging environments.
• Low-voltage core operation: 820 mV–880 mV supply range aligns with modern power-optimized system designs.
• RoHS compliance: Meets common environmental directives for electronic assemblies.

Why Choose 5SGXMA9K3H40I4G?

The 5SGXMA9K3H40I4G combines the Stratix V GX architecture’s documented transceiver capabilities with very high logic density and substantial on-chip memory, making it suitable for engineers designing high-performance, high-integration digital systems. Its large I/O count and industrial temperature rating help bridge demanding hardware requirements for communications, network processing, and other throughput-focused applications.

Designed within the Stratix V device family, this FPGA provides a balance of capacity, I/O flexibility, and thermal tolerance to support scalable designs that demand significant logic and memory resources while operating in challenging environments.

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