5SGXMA9N1F45C2LG

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA

Quantity 960 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMA9N1F45C2LG – Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA

The 5SGXMA9N1F45C2LG is a Stratix V GX field programmable gate array (FPGA) in a 1932-ball FCBGA package. It delivers high-density programmable logic with 840,000 logic elements and approximately 53 Mbits of embedded memory to support complex hardware designs.

This commercial-grade FPGA is targeted at applications that require large logic capacity, substantial on-chip RAM, and a high I/O count—packaged for surface-mount assembly and featuring a 0 °C to 85 °C operating range and a 820 mV–880 mV core supply window.

Key Features

  • Core Logic Capacity  840,000 logic elements provide extensive resources for implementing large-scale digital designs and custom hardware acceleration.
  • Embedded Memory  Approximately 53 Mbits of on-chip RAM to store buffers, lookup tables, and state data without external memory dependencies.
  • I/O Density  840 user I/O pins to enable dense routing and connectivity for complex board-level interfaces and multi-channel designs.
  • Power Supply  Specified core voltage range of 820 mV to 880 mV to match system power-rail design and regulator selection.
  • Package & Mounting  1932-BBGA (FCBGA) supplier device package, 1932-FBGA, FC (45×45), designed for surface-mount assembly in compact, high-pin-count layouts.
  • Operating Temperature  Commercial-grade operation from 0 °C to 85 °C for standard commercial environments.
  • Compliance  RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

  • High-density logic and compute  Implement large custom accelerators, state machines, and complex combinational/sequential logic using the FPGA’s 840,000 logic elements and abundant embedded RAM.
  • Multi-channel I/O systems  Drive systems that require many parallel interfaces or channelized data paths with the device’s 840 I/O pins.
  • Prototyping and system integration  Use the Stratix V GX device for platform prototyping where substantial on-chip resources and a high pin count are required for integration testing.

Unique Advantages

  • High logic capacity: The 840,000 logic elements enable implementation of complex designs without immediate partitioning or external logic.
  • Significant on-chip memory: Approximately 53 Mbits of embedded RAM reduce dependence on external memory components and simplify board-level BOM.
  • Large I/O complement: 840 I/O pins support dense interfacing to peripherals, high-speed connectors, and multi-lane systems.
  • Compact high-pin-count package: 1932-ball FCBGA packaging allows high connectivity within a compact footprint for space-constrained boards.
  • Commercial temperature rating: Qualified for 0 °C to 85 °C operation to match standard commercial product environments.
  • RoHS compliant: Facilitates lead-free manufacturing and environmental compliance.

Why Choose 5SGXMA9N1F45C2LG?

The 5SGXMA9N1F45C2LG positions itself as a high-capacity Stratix V GX FPGA for commercial designs that demand large programmable logic arrays, substantial on-chip RAM, and a high number of I/Os in a surface-mount FCBGA package. Its specifications make it suitable for complex digital systems where integration density and on-chip resources are primary considerations.

Design teams seeking scalability and a robust platform for complex hardware implementations will find the device’s combination of logic elements, embedded memory, and I/O count advantageous for reducing external component count and simplifying board-level design trade-offs.

Request a quote or submit an inquiry to obtain pricing, availability, and additional design support for the 5SGXMA9N1F45C2LG.

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