5SGXMA9N1F45C2LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 960 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMA9N1F45C2LG – Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA
The 5SGXMA9N1F45C2LG is a Stratix V GX field programmable gate array (FPGA) in a 1932-ball FCBGA package. It delivers high-density programmable logic with 840,000 logic elements and approximately 53 Mbits of embedded memory to support complex hardware designs.
This commercial-grade FPGA is targeted at applications that require large logic capacity, substantial on-chip RAM, and a high I/O count—packaged for surface-mount assembly and featuring a 0 °C to 85 °C operating range and a 820 mV–880 mV core supply window.
Key Features
- Core Logic Capacity 840,000 logic elements provide extensive resources for implementing large-scale digital designs and custom hardware acceleration.
- Embedded Memory Approximately 53 Mbits of on-chip RAM to store buffers, lookup tables, and state data without external memory dependencies.
- I/O Density 840 user I/O pins to enable dense routing and connectivity for complex board-level interfaces and multi-channel designs.
- Power Supply Specified core voltage range of 820 mV to 880 mV to match system power-rail design and regulator selection.
- Package & Mounting 1932-BBGA (FCBGA) supplier device package, 1932-FBGA, FC (45×45), designed for surface-mount assembly in compact, high-pin-count layouts.
- Operating Temperature Commercial-grade operation from 0 °C to 85 °C for standard commercial environments.
- Compliance RoHS compliant for lead-free manufacturing and regulatory alignment.
Typical Applications
- High-density logic and compute Implement large custom accelerators, state machines, and complex combinational/sequential logic using the FPGA’s 840,000 logic elements and abundant embedded RAM.
- Multi-channel I/O systems Drive systems that require many parallel interfaces or channelized data paths with the device’s 840 I/O pins.
- Prototyping and system integration Use the Stratix V GX device for platform prototyping where substantial on-chip resources and a high pin count are required for integration testing.
Unique Advantages
- High logic capacity: The 840,000 logic elements enable implementation of complex designs without immediate partitioning or external logic.
- Significant on-chip memory: Approximately 53 Mbits of embedded RAM reduce dependence on external memory components and simplify board-level BOM.
- Large I/O complement: 840 I/O pins support dense interfacing to peripherals, high-speed connectors, and multi-lane systems.
- Compact high-pin-count package: 1932-ball FCBGA packaging allows high connectivity within a compact footprint for space-constrained boards.
- Commercial temperature rating: Qualified for 0 °C to 85 °C operation to match standard commercial product environments.
- RoHS compliant: Facilitates lead-free manufacturing and environmental compliance.
Why Choose 5SGXMA9N1F45C2LG?
The 5SGXMA9N1F45C2LG positions itself as a high-capacity Stratix V GX FPGA for commercial designs that demand large programmable logic arrays, substantial on-chip RAM, and a high number of I/Os in a surface-mount FCBGA package. Its specifications make it suitable for complex digital systems where integration density and on-chip resources are primary considerations.
Design teams seeking scalability and a robust platform for complex hardware implementations will find the device’s combination of logic elements, embedded memory, and I/O count advantageous for reducing external component count and simplifying board-level design trade-offs.
Request a quote or submit an inquiry to obtain pricing, availability, and additional design support for the 5SGXMA9N1F45C2LG.

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