5SGXMA9N1F45C2N

The 5SGXMA9N1F45C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for high-density, high‑I/O programmable logic applications. This commercial‑grade device integrates 840,000 logic elements and approximately 53 Mbits of embedded memory in a high‑pin‑count 1932‑BBGA FCBGA package.

With up to 840 general‑purpose I/Os, a focused core supply range, and support for Stratix V GX device family electrical characteristics, this device targets designs that require dense logic, substantial on‑chip RAM, and a large I/O footprint in a surface‑mount package.

Key Features

• Core Logic  840,000 logic elements providing substantial programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 53 Mbits of on‑chip RAM to support buffering, packet memory, and embedded data storage.
• I/O Density  Up to 840 I/O pins to support wide parallel interfaces and high connector pinout counts.
• Package & Mounting  1932‑BBGA (FCBGA) package; supplier package listed as 1932‑FBGA, FC (45×45). Surface‑mount mounting type.
• Power  Core supply range specified at 870 mV to 930 mV for targeted power rail provisioning.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature range.
• Regulatory  RoHS compliant for lead‑free assembly and regulatory alignment.

Typical Applications

• High‑density digital processing  Use the large logic element count and embedded memory for complex state machines, packet processing, and algorithm acceleration.
• Multi‑I/O interface hubs  The high I/O count supports bridging, aggregation, and wide parallel interfaces between subsystems.
• Embedded system prototyping  Combine abundant logic and on‑chip RAM for system integration and rapid prototyping of SOC functions.

Unique Advantages

• High logic capacity: 840,000 logic elements enable integration of large, consolidated designs that reduce external component count.
• Substantial embedded memory: Approximately 53 Mbits of on‑chip RAM supports buffering and data‑intensive operations without immediate external memory dependency.
• Extensive I/O availability: Up to 840 I/Os facilitate complex board-level connectivity and dense peripheral integration.
• Compact, high‑pin package: 1932‑BBGA FCBGA (45×45 supplier footprint) delivers high pin density in a surface‑mount form factor for space‑constrained boards.
• Controlled core power rail: Specified core voltage range (870 mV–930 mV) simplifies power budgeting and rail design.
• Regulatory readiness: RoHS compliance aligns the device with common environmental requirements for commercial products.

Why Choose 5SGXMA9N1F45C2N?

The 5SGXMA9N1F45C2N positions itself as a high‑density Stratix V GX FPGA option for designs that require a large pool of programmable logic, substantial on‑chip memory, and a very high I/O count in a single surface‑mount package. Its defined core supply window and commercial temperature grading make it suitable for a wide range of commercial applications where integration density and I/O capacity are primary concerns.

Engineers selecting this device benefit from the ability to consolidate functions onto a single FPGA, reduce external component complexity, and leverage the Stratix V family electrical and switching characteristic documentation for system planning and validation.

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