5SGXMA9N1F45I2G

The 5SGXMA9N1F45I2G is a Stratix® V GX Field Programmable Gate Array (FPGA) IC offering very high logic density and on-chip memory capacity. This device provides 840,000 logic elements and substantial embedded RAM to support complex, high-density FPGA designs.

Designed as a surface-mount, industrial-grade FPGA in a 1932-ball FCBGA package, the device targets applications that require large programmable logic fabrics, extensive I/O, and operation across an extended temperature range.

Key Features

• Core and Logic Resources 840,000 logic elements for large-scale programmable logic implementations; device-level documentation lists 317,000 as the number of LABs/CLBs.
• Embedded Memory Approximately 53.25 Mbits of on-chip RAM (total RAM bits: 53,248,000) to support large buffers, memories, and stateful processing inside the FPGA.
• I/O Capacity 840 available I/O pins to connect multiple interfaces, peripherals, and high-pin-count system designs.
• Package and Mounting 1932-BBGA FCBGA package (supplier package: 1932-FBGA, FC (45×45)) with surface-mount construction for dense board-level integration.
• Power and Operating Conditions Specified voltage supply range of 870 mV to 930 mV and operating temperature range of −40 °C to 100 °C, supporting industrial-temperature deployments.
• Compliance RoHS-compliant materials and manufacturing status.

Typical Applications

• High-density digital processing — Large logic capacity and substantial on-chip RAM support complex data-paths, custom accelerators, and large combinatorial/sequential logic implementations.
• Multi-interface aggregation — With 840 I/Os, the device can interface to numerous peripherals and parallel buses for system consolidation.
• Industrial control and instrumentation — Industrial-grade temperature range and robust packaging make the device suitable for demanding embedded control and monitoring systems.

Unique Advantages

• High logic density: 840,000 logic elements provide the capacity to implement complex, large-scale FPGA designs without partitioning across multiple devices.
• Large embedded memory: Approximately 53.25 Mbits of on-chip RAM enable large buffers, lookup tables, and state machines inside the FPGA fabric.
• Extensive I/O count: 840 I/Os accommodate broad system-level connectivity and multiple simultaneous interfaces.
• Industrial-temperature readiness: Rated for −40 °C to 100 °C operation to meet extended-environment deployment requirements.
• Dense package format: 1932-ball FCBGA (1932-FBGA, FC (45×45)) supports high I/O and compact board layouts for space-constrained systems.
• Regulatory compliance: RoHS status is listed as compliant for environmentally conscious designs.

Why Choose 5SGXMA9N1F45I2G?

The 5SGXMA9N1F45I2G positions itself as a high-capacity Stratix V GX FPGA option for engineers who need significant logic and memory resources in a single device. Its combination of 840,000 logic elements, approximately 53.25 Mbits of embedded RAM, and 840 I/Os make it suitable for consolidating complex functions into one programmable IC.

With surface-mount FCBGA packaging, an industrial operating temperature range, and RoHS compliance, this device delivers a balance of integration, environmental robustness, and board-level density for demanding embedded and system applications.

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