5SGXMA9N2F45C2LN

The 5SGXMA9N2F45C2LN is a Stratix® V GX Field Programmable Gate Array (FPGA) optimized for high-density logic and extensive I/O integration. It provides 840,000 logic elements and approximately 53 Mbits of on-chip RAM in a surface-mount 1932-BBGA FCBGA package.

With a supply range of 820 mV to 880 mV and a commercial operating temperature range of 0 °C to 85 °C, this device targets designs that require large programmable logic capacity, substantial embedded memory, and a high count of I/O signals.

Key Features

• Core logic density  840,000 logic elements for complex, high-capacity designs.
• Embedded memory  Approximately 53 Mbits of on-chip RAM to support large data buffers and memory-intensive logic functions.
• I/O capability  840 user I/O pins to accommodate high pin-count interfaces and dense board-level connectivity.
• Device family – GX transceiver variant  Stratix V GX series characteristics as documented in the Stratix V device datasheet.
• Power supply  Core voltage supply specified from 820 mV to 880 mV.
• Package and mounting  1932-BBGA, FCBGA package (supplier package: 1932-FBGA, FC, 45×45 mm) in a surface-mount form factor.
• Operating grade and temperature  Commercial grade device rated for 0 °C to 85 °C operation.
• Regulatory compliance  RoHS compliant.

Typical Applications

• High-density logic systems  Use where large quantities of programmable logic are required; the device’s 840,000 logic elements support complex, multi-function implementations.
• Memory-intensive designs  Applications that need substantial on-chip RAM can leverage approximately 53 Mbits of embedded memory for buffering and local data storage.
• High I/O-count interfaces  Systems requiring large numbers of parallel or multiplexed signals benefit from the device’s 840 I/O capability.

Unique Advantages

• High programmable capacity: 840,000 logic elements enable large-scale custom logic and complex algorithm implementation without partitioning across multiple devices.
• Significant on-chip memory: Approximately 53 Mbits of embedded RAM reduces external memory dependence and simplifies board-level designs.
• Extensive connectivity: 840 I/O pins provide flexibility for dense interface requirements and multiple peripheral connections.
• Compact, board-ready package: The 1932-BBGA FCBGA (1932-FBGA, FC 45×45) surface-mount package delivers high pin count in a standardized footprint for streamlined assembly.
• Commercial operating range: Rated for 0 °C to 85 °C, suitable for a wide range of commercial electronic systems.
• Environmental compliance: RoHS-compliant construction supports regulatory requirements for lead-free systems.

Why Choose 5SGXMA9N2F45C2LN?

The 5SGXMA9N2F45C2LN positions itself as a high-capacity Stratix V GX FPGA for designs that demand significant programmable logic, large embedded memory, and a high I/O count within a compact surface-mount BGA package. Its electrical and package specifications support integration into commercial-grade systems where dense logic and on-chip RAM are primary design drivers.

This device is suitable for engineers and procurement teams seeking a scalable, high-density FPGA platform with documented Stratix V GX device characteristics and vendor datasheet support.

Request a quote or submit an inquiry to receive pricing and lead-time information for the 5SGXMA9N2F45C2LN. Our team will respond with the details you need to move forward with procurement and integration.