5SGXMA9N2F45C3N

The 5SGXMA9N2F45C3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, provided in a 1932-BBGA FCBGA surface-mount package. It delivers large-scale programmable logic, abundant on-chip memory, and extensive I/O for complex digital designs.

Targeted at commercial applications, this device combines approximately 840,000 logic elements with roughly 53.248 Mbits of embedded RAM and up to 840 I/Os, making it suitable for designs that require high logical density and wide connectivity within a commercial temperature range.

Key Features

• Core Logic  Approximately 840,000 logic elements for implementing large, complex digital designs.
• Embedded Memory  Approximately 53.248 Mbits of on-chip RAM for buffering, local storage, and lookup-tables.
• I/O Density  Up to 840 general-purpose I/Os to support broad system-level interfacing and parallel connectivity.
• Power Supply  Core voltage supply rated between 820 mV and 880 mV for operation within specified power conditions.
• Package & Mounting  1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC, 45 × 45) with surface-mount mounting type for high-density board designs.
• Operating Grade & Temperature  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant to support regulatory and environmental requirements.
• Stratix V GX Family Characteristics  Conforms to the Stratix V GX device family electrical and switching characteristics as defined in the device datasheet, including documented transceiver speed-grade options.

Typical Applications

• High‑density compute and acceleration  Large logic capacity and significant on-chip RAM enable implementation of complex acceleration kernels and custom compute pipelines.
• High‑speed communications and transceiver systems  Stratix V GX family transceiver speed-grade support (see device datasheet for speed-grade options) combined with abundant I/O make the device suitable for high-throughput link and packet-processing functions.
• System integration and prototyping  Extensive I/O and dense logic resources support integration of multiple subsystems and rapid prototyping of large FPGA-based designs.

Unique Advantages

• Large programmable fabric: Enables implementation of complex logic functions and large-scale designs without external logic expansion.
• Substantial embedded memory: Approximately 53.248 Mbits of on-chip RAM reduces reliance on external memory for buffering and intermediate data storage.
• High I/O count: Up to 840 I/Os simplifies system interfacing and supports parallel data paths and multiple submodules on a single device.
• Commercial-grade thermal envelope: Rated for 0 °C to 85 °C operation to meet typical commercial application requirements.
• Compact, high‑density package: 1932-BBGA FCBGA in a 45 × 45 supplier package enables high-density PCB layouts while maintaining surface-mount manufacturing compatibility.
• RoHS compliance: Helps address environmental and materials compliance considerations in product designs.

Why Choose 5SGXMA9N2F45C3N?

The 5SGXMA9N2F45C3N delivers a combination of large logic capacity, significant embedded memory, and extensive I/O in a commercial-grade Stratix V GX FPGA. Its package and surface-mount form factor support compact, high-density board implementations while the specified core voltage and operating temperature range align with commercial system requirements.

This device is well suited for engineering teams tackling large programmable logic challenges where on-chip resources and connectivity density reduce bill-of-material complexity and simplify system partitioning. Backed by Intel’s Stratix V device family documentation, it provides a verifiable basis for integrating high-density FPGA functionality into commercial products.

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