5SGXMA9N2F45I2LN

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA

Quantity 421 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMA9N2F45I2LN – Stratix® V GX FPGA, 840,000 Logic Elements, ~53.25 Mbits RAM, 840 I/O, 1932‑BBGA (FCBGA)

The 5SGXMA9N2F45I2LN is an Intel Stratix V GX field-programmable gate array supplied in a high‑pin‑count 1932‑BBGA FCBGA package. This industrial‑grade FPGA delivers large logic capacity, significant on‑chip memory, and a high number of user I/O to support complex programmable digital designs.

Targeted at designs that require high logic density, substantial embedded RAM, and broad I/O connectivity, the device provides a combination of integration and configurability for system-level implementation and high‑speed I/O requirements described for Stratix V GX family devices.

Key Features

  • Logic Capacity — 840,000 logic elements to implement large-scale programmable logic and custom hardware acceleration.
  • Logic Array Blocks — 317,000 logic array blocks (LABs/CLBs) for structured logic partitioning and floorplanning.
  • Embedded Memory — Approximately 53.25 Mbits of on‑chip RAM for buffering, FIFOs, and data‑path storage.
  • I/O Count — 840 user I/O pins to support wide parallel interfaces and multiple peripheral connections.
  • Power Supply — Core voltage range of 820 mV to 880 mV to match system power delivery requirements.
  • Package & Mounting — 1932‑BBGA FCBGA package (supplier device package: 1932‑FBGA, FC 45×45) with surface mount construction for high density board integration.
  • Temperature & Grade — Industrial grade operation from −40 °C to 100 °C for extended operating environments.
  • Environmental Compliance — RoHS compliant.
  • Stratix V GX Family Characteristics — Device documentation details Stratix V GX transceiver speed grades and electrical characteristics for high‑speed serial interfaces and robust device operation.

Typical Applications

  • High‑density programmable logic — Implements large custom accelerators, control logic, and glue logic where high logic element counts and on‑chip RAM are required.
  • High‑speed serial interfaces — Suitable for designs leveraging the Stratix V GX family’s transceiver capabilities for high‑bandwidth communications and data links.
  • System integration and prototyping — Provides ample I/O and memory for integrating multiple subsystems, evaluation platforms, and complex prototypes.

Unique Advantages

  • High logic density: 840,000 logic elements support complex, large‑scale implementations without external logic expansion.
  • Substantial embedded memory: Approximately 53.25 Mbits of RAM supports deep buffering, packet processing, and data‑intensive functions on‑chip.
  • Extensive I/O resources: 840 I/O pins enable flexible interfacing to large parallel buses, peripherals, and mezzanine modules.
  • Industrial temperature rating: −40 °C to 100 °C operation provides wider environmental tolerance for industrial deployments.
  • High‑pin‑count package: 1932‑BBGA FCBGA (45×45) enables maximum routing density and connectivity for board‑level integration.
  • Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing processes.

Why Choose 5SGXMA9N2F45I2LN?

The 5SGXMA9N2F45I2LN positions itself as a high‑capacity Stratix V GX FPGA option for engineers who need substantial programmable logic, significant on‑chip RAM, and a large complement of I/O in an industrial‑grade package. Its combination of 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and 840 I/Os makes it suited to demanding designs that require both integration density and flexible system interfacing.

With a 1932‑BBGA surface‑mount package and a defined core voltage range and temperature rating, this device offers a predictable platform for system designers seeking scalability, robust operation, and the architectural features documented for the Stratix V GX family.

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