5SGXMA9N2F45I3LN

The 5SGXMA9N2F45I3LN is a Stratix V GX field programmable gate array (FPGA) optimized for high-density programmable logic and dense I/O implementations. Built on the Stratix V GX family architecture, this device delivers large logic capacity, substantial on-chip memory, and a broad I/O set for advanced embedded and system-level designs.

With industrial temperature grading and RoHS compliance, the device is targeted at applications that require scalable logic resources, significant embedded memory, and robust operating conditions.

Key Features

• High Logic Capacity  Provides 840,000 logic elements for complex digital designs and large-scale logic integration.
• Embedded Memory  Approximately 53.25 Mbits of embedded memory to support buffering, large state machines, and on-chip data storage.
• Extensive I/O  840 user I/O pins to support wide parallel interfaces and multi-channel connectivity.
• Power Supply Range  Core voltage supply specified between 820 mV and 880 mV for core power planning and regulator selection.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for use in industrial environments.
• Package and Mounting  Available in a 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type simplifies PCB assembly.
• Regulatory  RoHS compliant.

Typical Applications

• High-density signal processing  Leverage the large logic array and on-chip memory for compute-heavy DSP pipelines and processing engines.
• Network and communications infrastructure  Use the extensive I/O complement and large logic resources for packet processing, protocol handling, and interface aggregation.
• Embedded compute and prototyping  Ideal for complex SoC prototyping, hardware acceleration, and systems that require flexible, reprogrammable logic.

Unique Advantages

• Large programmable fabric: The 840,000 logic elements enable consolidation of multiple functions on a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded memory supports deep buffering and state storage without external RAM.
• Wide I/O availability: 840 I/Os provide flexibility for parallel interfaces, numerous peripherals, or multi-lane connections.
• Industrial robustness: Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
• Compact surface-mount packaging: 1932-BBGA (FCBGA) package delivers high pin count in a 45×45 package footprint for space-constrained PCBs.
• Compliance-ready: RoHS compliance helps streamline regulatory considerations in many markets.

Why Choose 5SGXMA9N2F45I3LN?

The 5SGXMA9N2F45I3LN positions itself for designs that need a combination of very large programmable logic capacity, substantial embedded memory, and extensive I/O in a single, industrial-grade FPGA. Its specifications make it suitable for integrators and system designers who want to reduce board-level component count by consolidating functions onto a high-density FPGA.

Designed for long-term deployments, the device’s industrial temperature rating, surface-mount 1932-BBGA packaging, and RoHS compliance provide a practical balance of performance, reliability, and manufacturability for demanding applications.

Request a quote or submit an inquiry to obtain pricing and availability for the 5SGXMA9N2F45I3LN.