5SGXMA9N2F45I3LG

The 5SGXMA9N2F45I3LG is a Stratix® V GX field programmable gate array (FPGA) IC from Intel. It provides a high-density programmable fabric with 840,000 logic elements and approximately 53.25 Mbits of embedded memory for complex digital integration.

Designed for industrial-temperature deployments, this surface-mount FCBGA package offers up to 840 I/Os and operates with a core supply in the 0.820–0.880 V range, making it suitable for advanced, high-density system designs that require extensive on-chip logic and memory resources.

Key Features

• Core Capacity — 840,000 logic elements to implement large-scale digital designs and consolidate multiple functions on a single device.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for fast local data storage and buffering.
• I/O Density — Up to 840 general-purpose I/Os to support dense board-level interconnect and multiple peripheral interfaces.
• Package & Mounting — 1932‑BBGA / FCBGA (supplier package: 1932‑FBGA, FC 45×45) in a surface-mount form factor for compact PCB integration.
• Power Supply — Core voltage supply range of 820 mV to 880 mV to align with low-voltage system power domains.
• Operating Range — Industrial temperature grade with an operating temperature range of −40 °C to 100 °C for deployment in temperature-demanding environments.
• Compliance — RoHS compliant.

Typical Applications

• High-density digital systems — For designs requiring up to 840,000 logic elements and substantial embedded memory to integrate complex logic functions.
• I/O‑intensive platforms — For systems that need extensive board-level connectivity using up to 840 I/Os.
• Industrial equipment — Applicable where industrial operating temperatures (−40 °C to 100 °C) are required.

Unique Advantages

• Large programmable fabric: 840,000 logic elements enable consolidation of multiple subsystems into one device, reducing board-level component count.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM helps minimize external memory dependence and improves data throughput.
• High I/O capacity: 840 I/Os support dense peripheral interfacing and complex signal routing without immediate need for additional I/O expanders.
• Industrial temperature rating: −40 °C to 100 °C operation provides robustness for temperature-challenging deployments.
• Compact FCBGA packaging: 1932‑FBGA (45×45) surface-mount package enables high-density PCB designs while maintaining thermal and electrical performance.
• Low-voltage core operation: 0.820–0.880 V supply range supports integration into modern low-voltage power architectures.

Why Choose 5SGXMA9N2F45I3LG?

This Stratix® V GX FPGA balances substantial logic capacity, embedded memory, and high I/O count in a compact FCBGA package rated for industrial temperatures. It is positioned for designers who need to consolidate complex digital functions and I/O-rich subsystems into a single programmable device while maintaining compatibility with low-voltage core domains.

Selection of the 5SGXMA9N2F45I3LG is supported by the Stratix V device documentation and datasheet material, providing the electrical and operating characteristics needed for engineering evaluation and system integration.

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