5SGXMA9N3F45C2G

The 5SGXMA9N3F45C2G is a high-density Stratix V GX FPGA from Intel, packaged in a 1932-BBGA (FCBGA) format and intended for commercial temperature applications. This device integrates substantial programmable logic, memory, and I/O capacity—including 840,000 logic elements, approximately 53.2 Mbits of embedded memory, and 840 general-purpose I/Os—enabling complex, board-level programmable designs that require large logic and memory resources.

Built on the Stratix V GX family, the device adheres to the family electrical and transceiver characteristics documented in the device datasheet and is supplied as a surface-mount, RoHS-compliant component with a recommended core supply range of 870 mV to 930 mV and an operating temperature range of 0 °C to 85 °C.

Key Features

• Programmable Logic Capacity  840,000 logic elements provide high-density logic resources for complex custom logic and algorithm implementation.
• Embedded Memory  Approximately 53.2 Mbits of on-chip RAM to support large buffering, state storage, and data-path acceleration within the fabric.
• High I/O Count  840 I/O pins enable wide parallel interfaces and multiple peripheral connections on a single FPGA.
• Power and Supply  Core supply operating range specified at 870 mV to 930 mV to meet the device’s electrical requirements as documented in the datasheet.
• Package and Mounting  1932-BBGA (FCBGA) package, supplier package listed as 1932-FBGA, FC (45×45), and surface-mount mounting for compact board integration.
• Commercial Temperature Grade  Rated for commercial operation from 0 °C to 85 °C in accordance with the product data provided.
• Standards and Compliance  RoHS-compliant material status for regulatory and manufacturing compatibility.
• Family-Level Transceiver Options  As part of the Stratix V GX family, the device is offered across multiple transceiver speed grades per the Stratix V device documentation.

Typical Applications

• High-density custom logic  Implement large-scale, application-specific logic and acceleration using the device’s 840,000 logic elements and abundant embedded memory.
• High-port-count I/O systems  Support wide parallel interfaces and multiple peripherals with 840 available I/O pins for complex board-level designs.
• Programmable system integration  Consolidate multiple functions into a single programmable device using the fabric’s combination of logic, memory, and I/O resources.

Unique Advantages

• Substantial on-chip resources: 840,000 logic elements and approximately 53.2 Mbits of embedded RAM reduce reliance on external logic and memory, simplifying system architecture.
• High I/O density: 840 I/Os provide flexibility for complex interface requirements and multi-channel connectivity without external multiplexing.
• Compact package footprint: 1932-BBGA (FCBGA) package supports high-pin-count designs in a manufacturable surface-mount form factor.
• Commercial-grade availability: Specified for 0 °C to 85 °C operation and RoHS compliance for mainstream electronic product deployment.
• Documented family capabilities: Design and integration can leverage the Stratix V device documentation and electrical characteristics provided in the datasheet.

Why Choose 5SGXMA9N3F45C2G?

This Stratix V GX device is positioned for designs that require a combination of very large programmable logic capacity, significant on-chip memory, and a high number of external I/Os within a commercial temperature envelope. Its surface-mount 1932-BBGA package and RoHS compliance make it suitable for compact, production board-level deployments where consolidation of functions into a single FPGA reduces system complexity.

The device is best suited to engineering teams and procurement organizations seeking a documented, high-density Stratix V GX FPGA with clearly defined electrical parameters (870–930 mV core supply) and commercial operating range (0 °C to 85 °C). Reference to the Stratix V family datasheet is available for detailed electrical and transceiver characteristics when integrating this device into a design.

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