5SGXMA9N3F45C2LN

The 5SGXMA9N3F45C2LN is a Stratix V GX field programmable gate array (FPGA) IC offered in a 1932-BBGA FCBGA package. It provides a large programmable fabric with a high I/O count and substantial on-chip memory, making it suitable for commercial designs that require significant logic capacity and system integration.

Built on the Stratix V GX family architecture, this device targets applications that benefit from dense logic resources, large embedded memory, and extensive I/O connectivity while operating within a commercial temperature range.

Key Features

• Core and Logic Capacity 840,000 logic elements (cells) provide a large programmable fabric for complex custom logic and hardware acceleration.
• Embedded Memory Approximately 53.25 Mbits of on-chip RAM (total RAM bits: 53,248,000) for buffering, caching, and memory-intensive algorithms.
• I/O and Packaging 840 general-purpose I/O pins in a high-density 1932-BBGA FCBGA (supplier package: 1932-FBGA, FC 45×45) to support extensive external connectivity and board-level integration.
• Power and Supply Core voltage supply range of 820 mV to 880 mV, enabling operation within the specified low-voltage core window for the device.
• Mounting and Mechanical Surface-mount package optimized for modern PCB assembly processes and compact system layouts.
• Temperature and Grade Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.

Typical Applications

• High-density digital systems — Large logic capacity and abundant embedded memory enable complex custom datapaths and hardware acceleration within commercial equipment.
• Communications and networking — Extensive I/O and Stratix V GX family transceiver-oriented architecture support high-bandwidth interface integration and protocol processing.
• Prototype and system integration — The combination of logic density, memory, and high I/O count supports board-level prototyping and consolidation of multiple functions into a single device.

Unique Advantages

• High logic density: 840,000 logic elements offer substantial room for large-scale FPGA implementations and complex designs.
• Significant on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces the need for external memory in many designs.
• Extensive I/O count: 840 I/O pins enable broad connectivity to peripherals, memory, and high-speed interfaces.
• Compact, high-pin-count package: 1932-BBGA FCBGA (45×45) provides a dense, board-friendly solution for space-constrained systems.
• Low-voltage core operation: Operates within an 820 mV to 880 mV supply range consistent with modern low-voltage FPGA cores.
• Commercial temperature rating: Designed for 0 °C to 85 °C operation to meet standard commercial deployment requirements.

Why Choose 5SGXMA9N3F45C2LN?

The 5SGXMA9N3F45C2LN brings together a very large logic fabric, substantial embedded memory, and high I/O density in a compact surface-mount 1932-BBGA package. Its commercial-grade temperature range and defined core voltage window make it suitable for demanding commercial applications that require integration of complex logic, large buffering, and extensive external interfaces.

Designers seeking a scalable Stratix V GX family device for high-density, memory-intensive, and I/O-rich implementations will find this part well aligned to system-level consolidation and advanced prototyping efforts, while leveraging documented Stratix V electrical and switching characteristics from the device family datasheet.

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