5SGXMA9N3F45C4G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA

Quantity 1,119 Available (as of May 4, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMA9N3F45C4G – Stratix® V GX Field Programmable Gate Array (FPGA), 840,000 logic elements

The 5SGXMA9N3F45C4G is a Stratix® V GX family FPGA offering very large programmable logic capacity and substantial on-chip embedded memory. It is provided in a 1932-ball FCBGA package and is intended for commercial temperature applications.

As a Stratix V GX device, the series supports high-speed transceiver speed grades described in the device datasheet and is built to support complex, I/O-rich designs that require high logic density and significant embedded RAM resources.

Key Features

  • Logic Capacity — Approximately 840,000 logic elements to implement large, complex designs.
  • Embedded Memory — Approximately 53.248 Mbits of on-chip RAM for buffering, packet storage, and intermediate data processing.
  • I/O Resources — Up to 840 user I/O pins to support dense external connectivity and multi-channel interfaces.
  • Core Voltage — Core supply range 820 mV to 880 mV, enabling operation at specified Stratix V core voltage levels.
  • Package & Mounting — 1932-BBGA (FCBGA) / supplier package 1932-FBGA, FC (45×45); surface-mount device for standard PCB assembly flows.
  • Temperature & Grade — Commercial grade with an operating temperature range of 0°C to 85°C.
  • Standards Compliance — RoHS compliant.
  • Stratix V GX Series Characteristics — Datasheet for the Stratix V family documents GX transceiver speed grades (up to 14.1 Gbps per GX channel in the series), device electrical and switching characteristics, and package/density information.

Typical Applications

  • High-capacity programmable logic systems — Use the large logic element count and extensive embedded RAM for complex algorithm implementation and data-path acceleration.
  • I/O-dense interface hubs — Leverage up to 840 I/O pins for multi-channel data aggregation, protocol bridging, or interface concentrators.
  • High-speed serial link designs — Design teams targeting Stratix V GX transceiver grades can implement high-throughput serial interfaces supported by the GX family.

Unique Advantages

  • High integration density: Approximately 840,000 logic elements and ~53.248 Mbits of embedded memory reduce the need for external logic and RAM, simplifying system BOM.
  • Extensive I/O: 840 I/O pins provide the flexibility to connect many peripherals, sensors, or high-speed PHYs without additional multiplexing hardware.
  • Commercial-ready thermal profile: Operates across a 0°C to 85°C range and is marked as commercial grade for mainstream applications.
  • Industry-standard package: 1932-ball FCBGA (45×45) surface-mount package enables established PCB assembly processes and high-density board layouts.
  • Regulatory compliance: RoHS status is compliant, supporting restricted-substance requirements for many production programs.
  • Stratix V GX family capabilities: Series documentation details high-speed transceiver support and extensive electrical/switching characteristics for designers targeting high-throughput designs.

Why Choose 5SGXMA9N3F45C4G?

5SGXMA9N3F45C4G delivers a combination of very large programmable logic capacity and ample embedded memory in a high-pin-count FCBGA package, tailored for commercial applications that require dense logic, significant on-chip RAM, and extensive I/O. The Stratix V GX family documentation further provides guidance on transceiver performance and device electrical characteristics for system-level design.

This device is suitable for engineering teams building I/O-rich, compute-intensive FPGA designs that must balance integration density, power domain requirements (820–880 mV core supply), and standard surface-mount assembly in a commercial temperature envelope.

Request a quote or submit an inquiry to receive pricing and availability for 5SGXMA9N3F45C4G and to discuss how it fits your next FPGA design.

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