5SGXMA9N3F45I3G

The 5SGXMA9N3F45I3G is a Stratix V GX field programmable gate array (FPGA) supplied in a 1932-BBGA (FCBGA) package. It delivers a large programmable fabric with 840,000 logic elements and approximately 53.2 Mbits of embedded memory, plus an extensive I/O set and industrial temperature rating.

This device is intended for designs that require high logic capacity, substantial on-chip RAM, and a high I/O count while operating across an industrial temperature range. Its low-voltage core supply and surface-mount 1932-FBGA package support dense board-level integration.

Key Features

• Logic Capacity 840,000 logic elements for large-scale programmable designs.
• Embedded Memory Approximately 53.2 Mbits of total on-chip RAM to support buffering, packet processing, and data-intensive functions.
• I/O Density 840 I/O pins to accommodate complex board-level interfaces and multiple parallel connections.
• Package & Mounting 1932-BBGA (FCBGA) / Supplier package 1932-FBGA, FC (45×45); surface-mount for compact, high-density assemblies.
• Power Supply Core voltage supply range 820 mV to 880 mV for compatibility with low-voltage power domains.
• Industrial Temperature Grade Rated for operation from –40 °C to 100 °C for industrial deployments.
• Compliance RoHS compliant.

Typical Applications

• Large-scale programmable logic designs — systems that require hundreds of thousands of logic elements to implement complex state machines, datapaths, or custom processors.
• Memory-intensive processing — applications needing substantial on-chip RAM for buffering, packet processing, or streaming data handling.
• I/O-heavy systems — designs with extensive peripheral, networking, or parallel interface requirements that benefit from 840 I/Os.
• Industrial equipment — deployments that require operation across –40 °C to 100 °C and robust surface-mount packaging.

Unique Advantages

• High logic integration: 840,000 logic elements reduce the need for multi-chip partitioning and simplify complex designs.
• Substantial on-chip RAM: Approximately 53.2 Mbits of embedded memory supports large buffers and state storage without external memory.
• Extensive connectivity: 840 I/Os enable broad interfacing options and flexible board partitioning.
• Industrial operating range: Rated –40 °C to 100 °C for reliable operation in industrial environments.
• Compact, production-ready package: 1932-BBGA FCBGA surface-mount package supports dense PCB layouts and automated assembly.
• Low-voltage core: 0.82–0.88 V supply range aligns with modern power-optimized FPGA system designs.

Why Choose 5SGXMA9N3F45I3G?

The 5SGXMA9N3F45I3G positions itself for designs that demand a high count of programmable logic, significant embedded memory, and large I/O capacity while maintaining industrial temperature capability and a compact FCBGA package. Its specification set supports integration into dense, production assemblies that require robust on-chip resources and configurable I/O.

For engineering teams targeting scalability and long-term platform stability, this Stratix V GX device offers a clear specification-driven foundation—combining logic density, memory resources, and I/O breadth within a surface-mount 1932-BBGA footprint and an industrial operating range.

Request a quote or submit a procurement inquiry for part 5SGXMA9N3F45I3G to begin the sourcing process.