5SGXMA9N3F45I3LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 401 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMA9N3F45I3LG – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXMA9N3F45I3LG is an industrial-grade Stratix® V GX field programmable gate array (FPGA) IC supplied in a 1932-BBGA FCBGA package. It provides high logic capacity and large on-chip memory for demanding digital designs.
Key hardware attributes include 840,000 logic elements, approximately 53.2 Mbits of embedded RAM, up to 840 I/O pins, a low-voltage core supply range, and an industrial operating temperature range, making it suitable for systems that require dense logic and substantial on-chip resources.
Key Features
- Logic Capacity 840,000 logic elements for complex programmable logic and algorithm implementation.
- Embedded Memory Approximately 53.2 Mbits of on-chip RAM to support large buffering, LUTs, and data storage.
- I/O and Packaging Up to 840 I/O pins in a 1932-BBGA (FCBGA) package, with supplier package dimensions listed as 1932-FBGA, FC (45×45).
- Core Voltage Core supply voltage range from 820 mV to 880 mV for the device core power domain.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
- Family Transceiver Capability (series-level) The Stratix V GX family documentation describes transceiver speed grades; the series includes transceiver channels with documented speeds in the datasheet.
- Surface Mount Surface-mount package suitable for high-density PCB assembly.
- RoHS Compliant Meets RoHS environmental compliance requirements.
Typical Applications
- High-speed serial connectivity Leverage the Stratix V GX family transceiver capabilities for protocol bridging and high-bandwidth serial links as documented for the series.
- Compute and signal processing Use the large logic capacity and embedded RAM for implementation of signal processing pipelines, algorithms, and custom compute accelerators.
- System integration and I/O aggregation High I/O count supports dense peripheral interfacing and consolidation of multiple I/O domains on a single device.
- Industrial controls and embedded systems Industrial temperature rating and substantial on-chip resources support robust embedded control and automation applications.
Unique Advantages
- High logic density: 840,000 logic elements enable large, complex designs without immediate upscaling to multiple devices.
- Substantial embedded memory: Approximately 53.2 Mbits of on-chip RAM reduces reliance on external memory for many buffering and data-path needs.
- Extensive I/O capability: Up to 840 I/Os allow broad system connectivity and flexible interfacing options.
- Industrial temperature support: −40 °C to 100 °C operation supports deployment in industrial and harsh environments.
- Low-voltage core operation: Core supply range of 820–880 mV supports designs targeting modern low-voltage FPGA power domains.
- High pin-count package: 1932-BBGA (45×45) package provides the needed pin density for complex systems integration.
Why Choose 5SGXMA9N3F45I3LG?
5SGXMA9N3F45I3LG positions itself as a high-capacity, industrial-grade Stratix V GX FPGA suitable for designs that require dense logic resources, substantial on-chip RAM, and a large number of I/Os. The device’s documented electrical and switching characteristics in the Stratix V device datasheet support engineering evaluation and system-level integration.
This part is well suited for teams designing systems that demand integrated memory, broad I/O connectivity, and operation across industrial temperature ranges, while relying on the device-level specifications provided in the Stratix V GX family documentation.
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