5SGXMA9N3F45I4N

The 5SGXMA9N3F45I4N is a Stratix® V GX field-programmable gate array (FPGA) offered for industrial-grade applications. It provides a high-density logic fabric with substantial on-chip memory and a large I/O count, delivered in a 1932-ball FCBGA package suitable for surface-mount assembly.

Engineered for designs that require large logic capacity, abundant embedded memory, and broad external connectivity, this device targets complex digital systems in industrial and high-performance embedded markets.

Key Features

• Logic Capacity — 840,000 logic elements (LEs) to implement large-scale digital designs and complex hardware architectures.
• Embedded Memory — Approximately 53.248 Mbits of on-chip RAM for buffering, packet processing, and data-path storage.
• I/O Density — 840 user I/Os to support extensive peripheral and high-pin-count interface requirements.
• Power and Operating Range — Core voltage supply range of 820 mV to 880 mV, enabling defined core power delivery profiles for board-level power design.
• Package & Mounting — 1932-BBGA (FCBGA) supplier device package (1932-FBGA, FC 45×45), surface-mount mounting type for compact board integration.
• Temperature & Grade — Industrial grade with an operating temperature range of –40 °C to 100 °C for deployment in demanding environments.
• Standards Compliance — RoHS compliant, meeting common environmental directives for component selection and manufacturing.
• Stratix V GX Family Context — Part of the Stratix V GX series, which the datasheet describes with transceiver and speed-grade options for multi-gigabit channel configurations (refer to the official datasheet for family-level transceiver speed grades and options).

Typical Applications

• Industrial Control & Automation — Implement complex control algorithms, real-time processing, and large I/O interfacing for factory automation and equipment control.
• High-Performance Embedded Systems — Deploy as the central programmable fabric for compute- and data-intensive embedded platforms that require large logic and memory resources.
• Communications Infrastructure — Use the device’s high I/O count and Stratix V GX family transceiver options for protocol processing and board-level aggregation tasks.
• Signal Processing — Leverage dense logic and on-chip RAM for buffering and pipeline implementation in DSP, video, or sensor-processing pipelines.

Unique Advantages

• High logic density: 840,000 logic elements enable integration of extensive custom logic and IP blocks on a single device, reducing board-level complexity.
• Substantial embedded memory: Approximately 53.248 Mbits of on-chip RAM supports large buffers, FIFOs, and state storage without relying solely on external memory.
• Extensive I/O resources: 840 I/Os provide flexibility to interface with multiple peripherals, parallel buses, and high-pin-count connectors.
• Industrial temperature rating: Operation from –40 °C to 100 °C suits deployment in environments with wide thermal variation.
• Board-level form factor: 1932-ball FCBGA package and surface-mount mounting optimize board density and mechanical robustness for complex PCBs.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and reduces material-restriction concerns.

Why Choose 5SGXMA9N3F45I4N?

The 5SGXMA9N3F45I4N balances very large logic capacity and meaningful embedded memory with a high I/O count and industrial operating range, making it a strong candidate for designs that consolidate multiple functions onto a single FPGA. Its package and surface-mount form factor enable compact, production-ready board layouts.

This device suits engineering teams developing complex embedded, industrial, and communications systems that require scalable logic resources, on-chip memory for high-throughput data paths, and broad external connectivity, while adhering to RoHS requirements.

If you would like pricing, availability, or to submit a purchase inquiry for 5SGXMA9N3F45I4N, please request a quote or submit an RFQ through your preferred procurement channel.