5SGXMA9N3F45I4G

The 5SGXMA9N3F45I4G is a Stratix® V GX field programmable gate array (FPGA) IC offering high on-chip capacity and industrial temperature grading. It integrates 840,000 logic elements and approximately 53.2 Mbits of embedded memory to support dense, programmable logic implementations.

Packaged in a 1932-ball FCBGA (45 × 45 mm) surface-mount package and rated for an operating temperature range of −40 °C to 100 °C, this device is specified for industrial applications and supports a core supply range of 820 mV to 880 mV.

Key Features

• Stratix V GX architecture  High-capacity Stratix V GX FPGA family member as identified in the product name and datasheet series information.
• Large logic capacity  840,000 logic elements (cells) to implement complex, high-density digital designs.
• Embedded memory  Approximately 53.2 Mbits of on-chip RAM for data buffering, scratchpad storage, and state retention.
• I/O density  840 I/O pins to support extensive peripheral interfacing and multi-channel connectivity.
• Industrial temperature grade  Specified for −40 °C to 100 °C operation, suitable for thermally demanding environments.
• Power and core supply  Core voltage supply range of 820 mV to 880 mV to match targeted power domains and board-level rails.
• Package and mounting  1932-BBGA / FCBGA package (supplier package listed as 1932-FBGA, FC 45×45) with surface-mount mounting for compact board integration.
• RoHS compliant  Device meets RoHS requirements as noted in the product data.

Typical Applications

• High-density signal processing  Large logic element count and extensive embedded memory support complex signal processing pipelines.
• Multi-channel interfacing  High I/O density enables aggregation of numerous digital interfaces and parallel channels.
• Industrial control and automation  Industrial temperature grading and surface-mount FCBGA packaging suit deployment in industrial systems.

Unique Advantages

• High programmable capacity: 840,000 logic elements allow implementation of large-scale, custom logic without external ASICs.
• Substantial on-chip memory: Approximately 53.2 Mbits of embedded RAM reduces dependence on external memory for many designs.
• Extensive I/O: 840 I/O pins provide flexibility for interfacing with multiple peripherals and high-channel-count systems.
• Industrial-ready thermal range: Rated from −40 °C to 100 °C to match industrial deployment requirements.
• Compact, high-ball-count package: 1932-ball FCBGA (45 × 45 mm) enables dense system integration while maintaining signal routing options.
• Standards-aligned manufacture: RoHS compliance supports regulatory and environmental requirements.

Why Choose 5SGXMA9N3F45I4G?

The 5SGXMA9N3F45I4G positions itself as a high-capacity, industrial-grade Stratix V GX FPGA suitable for designs that require large programmable logic resources, significant on-chip memory, and high I/O density. Its specified voltage range, industrial temperature rating, and FCBGA packaging make it appropriate for compact, demanding embedded systems.

Engineers specifying this device benefit from a scalable FPGA architecture in the Stratix V family and the detailed electrical and switching characteristics provided in the series datasheet, supporting informed system-level power and thermal planning.

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