5SGXMA9N3F45I3N

The 5SGXMA9N3F45I3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC by Intel. It delivers a large programmable fabric with substantial embedded memory and an extensive I/O count, packaged in a high-density 1932-ball FCBGA.

Engineered for designs offered in industrial temperature grade, this device targets systems that require high-density logic, significant on-chip RAM, and broad I/O provisioning while operating across a wide core-voltage and temperature range.

Key Features

• Large programmable fabric — 840,000 logic elements provide broad capacity for complex logic, control, and custom hardware acceleration.
• Embedded memory — Approximately 53 Mbits of on-chip RAM to support buffering, data caching, and memory-intensive functions.
• Extensive I/O — 840 I/O resources for dense board-level interfacing and multi-channel system connectivity.
• Core voltage range — Core supply specified from 820 mV to 880 mV to match system power domains and regulator designs.
• Industrial temperature grade — Rated for operation from −40 °C to 100 °C for deployment in temperature-demanding environments.
• Package and mounting — 1932-BBGA (FCBGA) package, surface-mount, suitable for high-density PCB implementations.
• Standards and compliance — RoHS-compliant device meeting environmental material requirements.

Typical Applications

• High-density FPGA compute — Use the large logic element count and on-chip RAM for complex processing, custom accelerators, or large-scale state machines.
• I/O-intensive systems — Deploy in applications requiring many parallel interfaces or multi-channel connectivity using the device’s 840 I/O resources.
• Industrial equipment — Suitable for industrial-grade systems that must operate across −40 °C to 100 °C while maintaining logic capacity and embedded memory.
• Systems using programmable transceivers — Stratix V GX family documentation includes transceiver-grade options for designs that require programmable serial connectivity.

Unique Advantages

• Significant logic capacity: 840,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing external components.
• Substantial on-chip RAM: Approximately 53 Mbits of embedded memory lowers dependence on external memory for data buffering and accelerates local data access.
• High I/O density: 840 I/O resources provide flexibility for complex board-level interfacing and parallel data paths.
• Industrial temperature support: −40 °C to 100 °C operating range supports deployment in thermally challenging environments.
• High-density FCBGA package: 1932-ball FCBGA (45×45) enables compact PCB layouts while accommodating the device’s I/O and power requirements.
• Controlled core-voltage window: 0.820–0.880 V supply range supports designs with tight power-domain specifications.

Why Choose 5SGXMA9N3F45I3N?

The 5SGXMA9N3F45I3N positions itself as a high-capacity Stratix V GX FPGA option for designs that require a combination of large logic resources, substantial embedded memory, and abundant I/O in an industrial-grade device. Its package and electrical characteristics make it suitable for integration into space-constrained, performance-oriented boards where on-chip resources reduce external component count.

For teams developing complex programmable logic systems that must operate across a wide temperature range and adhere to RoHS requirements, this device offers a balanced set of silicon resources and package density backed by Stratix V family documentation.

If you would like pricing, availability, or a formal quote for the 5SGXMA9N3F45I3N, submit a request for a quote or sales inquiry to receive detailed procurement information.