5SGXMABK1H40C2G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 952000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 829 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-HBGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 359200 | Number of Logic Elements/Cells | 952000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMABK1H40C2G – Stratix® V GX FPGA, 952,000 logic elements, 696 I/O, 1517-BBGA
The 5SGXMABK1H40C2G is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 1517-ball FCBGA package. It provides a high-density programmable fabric with 952,000 logic elements and approximately 53.25 Mbits of embedded memory for complex logic and memory-hungry implementations.
Designed for commercial electronic systems, this device offers a very large I/O count (696 pins), a low-voltage core supply range (870 mV–930 mV), and a commercial operating temperature range of 0 °C to 85 °C, making it suitable for demanding board-level integration where density and on-chip resources matter.
Key Features
- Core & Logic 952,000 logic elements provide a large programmable fabric to implement extensive custom logic and control functions.
- Embedded Memory Approximately 53.25 Mbits of on-chip RAM to support buffer, LUT, and local storage requirements within the FPGA fabric.
- I/O Capacity 696 user I/O pins for high-pin-count interface consolidation and flexible board-level connectivity.
- Power Core voltage supply range of 870 mV to 930 mV to support the device's power and performance operating points.
- Package & Mounting 1517-BBGA (FCBGA) package — supplier device package listed as 1517-HBGA (45×45) — supplied for surface-mount board assembly.
- Operating Conditions Commercial-grade device with specified operating temperature range of 0 °C to 85 °C.
- Compliance RoHS-compliant manufacturing status.
Typical Applications
- High-density logic systems Implement large, custom digital designs that require hundreds of thousands of logic elements and substantial on-chip memory.
- Multi-interface aggregation Consolidate many peripheral and protocol interfaces on a single device using the 696 I/O pins for board-level system integration.
- Commercial embedded systems Deploy in commercial-grade electronics where the specified 0 °C–85 °C temperature range and surface-mount package meet assembly and environmental requirements.
- Prototyping and complex FPGA designs Use the large logic and memory resources for development platforms and advanced prototype validation.
Unique Advantages
- Extensive programmable fabric: 952,000 logic elements enable implementation of large-scale custom logic without immediate partitioning across multiple FPGAs.
- Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for many application buffers and temporary storage.
- High I/O density: 696 I/O pins allow complex system interfacing and reduce the need for external multiplexing or additional interface chips.
- Compact, board-ready package: 1517-ball FCBGA in a 45×45 supplier package footprint supports high-density PCB layouts and surface-mount assembly.
- Commercial deployment-ready: Commercial-grade temperature rating and RoHS compliance align with standard electronics manufacturing and regulatory expectations.
- Controlled core voltage range: 870 mV–930 mV core supply window provides defined operating points for power budgeting and thermal planning.
Why Choose 5SGXMABK1H40C2G?
The 5SGXMABK1H40C2G combines a very large logic capacity, significant embedded memory, and a high I/O count in a compact FCBGA package, making it a strong choice for commercial designs that require dense, on-chip resources. Its defined operating voltage and temperature range support predictable power and thermal design in board-level integration.
This Stratix V GX device is suited for engineers and system designers who need to consolidate complex functions into a single FPGA, reduce external component count, and leverage a well-documented device family for development and deployment.
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