5SGXMABK1H40C2G

IC FPGA 696 I/O 1517HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 696 53248000 952000 1517-BBGA, FCBGA

Quantity 829 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1517-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1517-BBGA, FCBGANumber of I/O696Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMABK1H40C2G – Stratix® V GX FPGA, 952,000 logic elements, 696 I/O, 1517-BBGA

The 5SGXMABK1H40C2G is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 1517-ball FCBGA package. It provides a high-density programmable fabric with 952,000 logic elements and approximately 53.25 Mbits of embedded memory for complex logic and memory-hungry implementations.

Designed for commercial electronic systems, this device offers a very large I/O count (696 pins), a low-voltage core supply range (870 mV–930 mV), and a commercial operating temperature range of 0 °C to 85 °C, making it suitable for demanding board-level integration where density and on-chip resources matter.

Key Features

  • Core & Logic  952,000 logic elements provide a large programmable fabric to implement extensive custom logic and control functions.
  • Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffer, LUT, and local storage requirements within the FPGA fabric.
  • I/O Capacity  696 user I/O pins for high-pin-count interface consolidation and flexible board-level connectivity.
  • Power  Core voltage supply range of 870 mV to 930 mV to support the device's power and performance operating points.
  • Package & Mounting  1517-BBGA (FCBGA) package — supplier device package listed as 1517-HBGA (45×45) — supplied for surface-mount board assembly.
  • Operating Conditions  Commercial-grade device with specified operating temperature range of 0 °C to 85 °C.
  • Compliance  RoHS-compliant manufacturing status.

Typical Applications

  • High-density logic systems  Implement large, custom digital designs that require hundreds of thousands of logic elements and substantial on-chip memory.
  • Multi-interface aggregation  Consolidate many peripheral and protocol interfaces on a single device using the 696 I/O pins for board-level system integration.
  • Commercial embedded systems  Deploy in commercial-grade electronics where the specified 0 °C–85 °C temperature range and surface-mount package meet assembly and environmental requirements.
  • Prototyping and complex FPGA designs  Use the large logic and memory resources for development platforms and advanced prototype validation.

Unique Advantages

  • Extensive programmable fabric: 952,000 logic elements enable implementation of large-scale custom logic without immediate partitioning across multiple FPGAs.
  • Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces dependence on external memory for many application buffers and temporary storage.
  • High I/O density: 696 I/O pins allow complex system interfacing and reduce the need for external multiplexing or additional interface chips.
  • Compact, board-ready package: 1517-ball FCBGA in a 45×45 supplier package footprint supports high-density PCB layouts and surface-mount assembly.
  • Commercial deployment-ready: Commercial-grade temperature rating and RoHS compliance align with standard electronics manufacturing and regulatory expectations.
  • Controlled core voltage range: 870 mV–930 mV core supply window provides defined operating points for power budgeting and thermal planning.

Why Choose 5SGXMABK1H40C2G?

The 5SGXMABK1H40C2G combines a very large logic capacity, significant embedded memory, and a high I/O count in a compact FCBGA package, making it a strong choice for commercial designs that require dense, on-chip resources. Its defined operating voltage and temperature range support predictable power and thermal design in board-level integration.

This Stratix V GX device is suited for engineers and system designers who need to consolidate complex functions into a single FPGA, reduce external component count, and leverage a well-documented device family for development and deployment.

Request a quote or submit an inquiry to receive pricing, lead-time, and availability information for the 5SGXMABK1H40C2G.

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