5SGXMABK1H40I2G

The 5SGXMABK1H40I2G is a Stratix® V GX field-programmable gate array (FPGA) from Intel, designed for high-density, industrial-grade programmable logic applications. It combines a large logic fabric with substantial embedded memory and a high I/O count to address complex system designs that require extensive on-chip resources and robust operating-range characteristics.

With 952,000 logic elements, approximately 53.25 Mbits of embedded memory, and 696 I/Os in a 1517-BBGA FCBGA package, this device targets industrial applications that demand high integration, broad temperature tolerance, and a compact surface-mount form factor.

Key Features

• Logic Capacity — 952,000 logic elements provide a large programmable fabric for complex digital designs and extensive parallel processing.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support large buffers, FIFOs, and local data storage without external memory dependence.
• I/O Density — 696 dedicated I/O pins to support wide parallel interfaces and dense connectivity for sensors, transceivers, or external peripherals.
• Transceiver Variant — Part of the Stratix V GX family as identified in the product name and datasheet content.
• Power — Core voltage supply range of 870 mV to 930 mV, enabling predictable core-power planning in system designs.
• Package — 1517-BBGA, FCBGA package (supplier device package listed as 1517-HBGA, 45×45) for high pin-count, high-density board integration.
• Mounting — Surface-mount package suitable for standard PCB assembly processes.
• Industrial Grade — Industrial temperature grade with an operating range of −40 °C to 100 °C for deployment in demanding environments.
• Compliance — RoHS‑compliant manufacturing status.

Typical Applications

• Industrial Control — High logic capacity and extended temperature range support complex control algorithms, real-time processing, and rugged deployment in factory and process automation.
• Communications Infrastructure — Large on-chip memory and abundant I/Os enable buffering, protocol processing, and interfacing in network equipment and baseband applications.
• Signal Processing — Dense logic and embedded RAM provide resources for high-throughput DSP pipelines, data aggregation, and preprocessing in instrumentation and test equipment.
• FPGA-Based Prototyping — The combination of extensive logic elements and I/O count makes this device suitable for hardware emulation, prototype boards, and system validation platforms.

Unique Advantages

• High integration density: 952,000 logic elements reduce the need for multiple devices, simplifying board design and lowering BOM complexity.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM enables larger local storage for latency-sensitive applications and reduces external memory dependencies.
• Extensive I/O capability: 696 I/Os provide flexible connectivity options for wide-parallel interfaces and multiple peripheral domains.
• Industrial operating range: Rated for −40 °C to 100 °C to support deployment in temperature-challenging environments.
• Compact, high-pin-count package: 1517-BBGA FCBGA in a 45×45 supplier package footprint supports dense routing and high-speed board layouts.
• Predictable core power planning: Specified core supply from 870 mV to 930 mV assists system power-supply design and thermal management.

Why Choose 5SGXMABK1H40I2G?

The 5SGXMABK1H40I2G provides a balanced combination of very large logic capacity, significant embedded memory, and high I/O density in an industrial-grade Stratix V GX FPGA. It is positioned for designs that require substantial on-chip resources, wide temperature tolerance, and a compact, surface-mount, high-pin-count package.

Ideal for engineering teams building industrial control systems, communications infrastructure, high-performance signal processing, and prototype platforms, this device delivers the hardware resources needed to consolidate functions, streamline PCB complexity, and support long-term deployment backed by Intel’s Stratix V device documentation.

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