5SGXMABK2H40C2LN

The 5SGXMABK2H40C2LN is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. It delivers a high-density fabric and substantial on-chip memory for complex logic, signal processing, and high-speed serial interface functions.

Targeted at commercial-grade applications, this device combines 952,000 logic elements, approximately 53.25 Mbits of embedded RAM, and 696 user I/Os to support large FPGA designs that require extensive logic capacity and I/O integration.

Key Features

• High logic density — 952,000 logic elements to implement large-scale digital designs and complex custom accelerators.
• Embedded memory — Approximately 53.25 Mbits of on-chip RAM to support buffering, FIFOs, and intermediate data storage without external memory for many use cases.
• Extensive I/O — 696 user I/Os enabling broad interfacing options for multi-channel systems and dense board-level connectivity.
• Low-voltage core — Core supply specified between 820 mV and 880 mV to align with modern power-optimized FPGA system designs.
• Commercial temperature grade — Rated for 0 °C to 85 °C operation for commercial applications.
• Package and mounting — 1517-BBGA, FCBGA package (supplier device package listed as 1517-HBGA, 45×45 mm) with surface-mount assembly for compact, high-density PCB designs.
• RoHS compliant — Meets environmental compliance requirements for lead-free manufacturing.

Typical Applications

• High-speed communications — Leverage the Stratix V GX family’s transceiver-capable architecture for line-rate packet processing and multi-Gbps serial links.
• Network acceleration — Use the large logic capacity and on-chip RAM for packet inspection, forwarding engines, and custom offload functions.
• Signal processing and compute — Implement complex DSP pipelines and parallel compute engines that require large numbers of logic elements and embedded memory.
• Prototyping and custom SoC integration — Dense I/O and high logic count make this device suitable for prototyping ASIC functions or integrating custom peripherals on an FPGA platform.

Unique Advantages

• Large-scale integration: 952,000 logic elements enable consolidation of multiple functions into a single device, reducing BOM and board complexity.
• Significant embedded RAM: Approximately 53.25 Mbits of on-chip memory supports deep buffering and stateful processing without immediate reliance on external memory.
• High I/O count: 696 I/Os provide flexible interfacing for multi-lane systems, dense peripheral connectivity, and mezzanine-style interconnects.
• Compact package: 1517-BBGA FCBGA in a 45×45 mm supplier package footprint supports high-density board layouts while maintaining surface-mount assembly.
• Commercial readiness: 0 °C to 85 °C operating range and RoHS compliance align the device with mainstream electronics manufacturing and deployment.
• Power-defined core: Specified core voltage range (820 mV–880 mV) allows designers to plan power delivery for optimized efficiency and stability.

Why Choose 5SGXMABK2H40C2LN?

This Stratix V GX FPGA part delivers a balance of very high logic capacity, substantial embedded memory, and a large I/O count in a compact surface-mount BGA package. It is positioned for commercial applications that require consolidation of complex digital functions, high-throughput data handling, and extensive board-level interfacing.

Designers and system architects will find this device suitable when projects demand scalable logic resources, robust on-chip RAM, and flexibility for high-speed serial and parallel interfaces, while aligning with standard commercial temperature and manufacturing requirements.

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