5SGXMABK2H40C2G

The 5SGXMABK2H40C2G is a high-density Stratix® V GX Field Programmable Gate Array (FPGA) from Intel (Altera). It integrates 952,000 logic elements and approximately 53.25 Mbits of embedded memory to support complex, large-scale digital designs.

Designed for commercial-grade applications, this surface-mount FCBGA device provides extensive I/O (696 pins), on-chip memory, and a low core supply voltage range, making it suitable for multi-gigabit serial connectivity, memory-intensive processing, and large logic integration scenarios.

Key Features

• Logic Capacity — 952,000 logic elements to implement large finite-state machines, datapaths, and custom accelerators.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM to support buffering, lookup tables, and on-chip data storage.
• I/O Density — 696 I/O pins to accommodate multiple interfaces, wide bus widths, and complex board-level interconnects.
• Core Supply Voltage — 870 mV to 930 mV supply range for core power, enabling designs that target the Stratix V GX power envelope.
• Package and Mounting — 1517-ball BGA (FCBGA / supplier package 1517-HBGA, 45×45 mm); designed for surface-mount assembly.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation for standard commercial environments.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• Multi‑Gigabit Serial Connectivity — High logic and I/O density combined with Stratix V GX transceiver family characteristics support multi‑Gbps serial interfaces and protocol bridging.
• Memory‑Intensive FPGA Designs — Large embedded RAM capacity for buffering, packet processing, and on-chip data manipulation.
• Large‑Scale Logic Integration — Implement complex control, signal-processing, or custom accelerator functions that require nearly one million logic elements.
• High‑Pin‑Count Systems — 696 I/Os enable integration with wide external buses, multiple peripherals, and board-level subsystems.

Unique Advantages

• High Logic Density: 952,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Substantial On‑Chip Memory: Approximately 53.25 Mbits of embedded RAM help minimize external memory dependence and improve data throughput.
• Extensive I/O Capability: 696 I/Os give designers flexibility for diverse interface requirements without sacrificing routing options.
• Compact High‑Pin Package: 1517-ball FCBGA (45×45 mm) balances high density with a package form factor suited for surface-mount assembly.
• Commercial Temperature Range: Rated 0 °C to 85 °C for standard commercial deployments and controlled-environment installations.
• RoHS Compliant: Meets lead-free requirements for environmentally driven designs.

Why Choose 5SGXMABK2H40C2G?

The 5SGXMABK2H40C2G provides a high-capacity Stratix V GX FPGA solution that pairs nearly one million logic elements with substantial embedded memory and high I/O density in a single FCBGA package. Its commercial temperature rating and compact 1517-ball package make it well suited for advanced communications, compute, and data-path applications where integration and on-chip resources are priorities.

Backed by Intel (Altera) device documentation and supported design flows, this device is appropriate for development teams targeting large-scale, high-density FPGA implementations that require a balance of logic, memory, and connectivity in a commercial-grade FPGA product.

Request a quote or submit an availability inquiry to discuss pricing, lead times, and volume options for the 5SGXMABK2H40C2G.