5SGXMABK1H40C2N

The 5SGXMABK1H40C2N is a Stratix® V GX field-programmable gate array (FPGA) IC designed for commercial-temperature applications. It delivers very high logic capacity, abundant embedded memory, and a large I/O complement in a 1517-ball BGA (FCBGA) package.

Targeted at designs that require substantial on-chip programmable logic, wide I/O connectivity, and compact surface-mount packaging, this device provides a balance of integration and performance for demanding system-level implementations.

Key Features

• Core Logic — 952,000 logic elements (logic cells) for implementing large, complex designs and high-density logic functions.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM (total RAM bits: 53,248,000) to support buffering, packet processing, and large state machines without external memory.
• I/O Density — 696 I/O pins to enable broad peripheral interfacing, high-pin-count bus implementations, and multi-channel system integration.
• Power Supply — Core supply range from 870 mV to 930 mV as specified for device operation.
• Package and Mounting — 1517-BBGA FCBGA package (supplier package: 1517-HBGA, 45 × 45 mm) with surface-mount mounting for compact board-level integration.
• Temperature Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS-compliant.

Typical Applications

• High-density logic systems — Implement large FPGA designs where extensive programmable logic resources are required on a single device.
• Memory-intensive processing — Use the substantial on-chip RAM for buffering, data-path acceleration, and state storage to reduce dependence on external memory.
• Complex I/O interfacing — Employ the 696 I/O pins for multi-protocol front-end connectivity, sensor aggregation, or high-pin-count bus implementations.

Unique Advantages

• Extensive programmable capacity: 952,000 logic elements enable consolidation of complex functions into a single FPGA, simplifying board design and reducing component count.
• Large embedded memory: Approximately 53.25 Mbits of on-chip RAM supports larger data buffers and deeper pipelines without immediate need for external DRAM.
• High I/O count: 696 I/O pins provide flexibility for routing multiple interfaces and parallel buses directly to the FPGA.
• Compact surface-mount package: 1517-ball FCBGA (45 × 45 mm footprint) allows high-density placement while maintaining robust package options for system integration.
• Commercial-grade operating range: Specified for 0 °C to 85 °C operation, suitable for standard commercial deployments.
• Regulatory compliance: RoHS-compliant construction supports environmental and regulatory requirements for many commercial products.

Why Choose 5SGXMABK1H40C2N?

The 5SGXMABK1H40C2N positions itself as a high-capacity Stratix V GX FPGA suitable for designs that need a large pool of logic resources, substantial embedded memory, and extensive I/O in a compact surface-mount BGA package. Its commercial temperature rating and RoHS compliance make it appropriate for mainstream commercial systems where on-chip integration and board-space efficiency are priorities.

Choose this device when your design demands scalable programmable logic, significant on-chip RAM to reduce external memory dependencies, and a high I/O count to accommodate complex interfacing and system integration needs.

Request a quote or submit a request for pricing and availability to begin evaluating the 5SGXMABK1H40C2N for your next design.