5SGXMA9N3F45C2N

The 5SGXMA9N3F45C2N is a Stratix V GX field-programmable gate array (FPGA) IC in a high-pin-count ball grid array package. It combines very high logic capacity with substantial on-chip memory and a large number of I/Os to address complex digital designs that require dense programmable logic and extensive external connectivity. This device is offered as a commercial-grade, surface-mount component with clearly defined supply and operating ranges for system integration.

Key Features

• Core Logic  840,000 logic elements for implementing large, complex logic designs and custom architectures.
• Embedded Memory  Approximately 53.25 Mbits of on-chip RAM to support buffering, large state storage, and memory-intensive algorithms.
• I/O Capacity  Up to 840 general-purpose I/Os to support wide device interfacing and high channel counts.
• Package & Mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type.
• Power  Core supply specified between 870 mV and 930 mV to guide power-supply design and sequencing.
• Operating Conditions & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital systems  Use the large logic capacity and on-chip RAM for complex finite-state machines, datapath processing, and custom accelerators.
• I/O-intensive designs  With up to 840 I/Os, the device supports systems that require broad external interfacing and parallel connectivity.
• Prototyping and custom logic integration  The combination of logic resources and embedded memory enables consolidation of custom functions into a single programmable device.

Unique Advantages

• High logic capacity: 840,000 logic elements provide the headroom to implement large, multi-function designs within a single FPGA.
• Substantial on-chip memory: Approximately 53.25 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage.
• Extensive I/O count: Up to 840 I/Os simplifies board-level routing for wide interfaces and parallel data paths.
• Compact, high-pin-count package: 1932-ball BGA packaging delivers high connectivity in a controlled footprint for dense PCBs.
• Commercial deployment-ready: Commercial temperature grading (0 °C to 85 °C) and RoHS compliance support standard product deployments and regulatory requirements.

Why Choose 5SGXMA9N3F45C2N?

The 5SGXMA9N3F45C2N provides a combination of very high logic density, significant embedded memory, and a large I/O complement in a single commercial-grade Stratix V GX package. These attributes make it suitable for designs that need to integrate extensive custom logic and on-chip buffering while maintaining a compact board footprint. Its defined supply and temperature ranges help simplify power and thermal planning for commercial applications.

For teams building complex digital systems that require consolidated programmable logic, substantial local memory, and broad external interfacing, the 5SGXMA9N3F45C2N delivers a verified specification set to evaluate during architecture and BOM selection.

Request a quote or submit a procurement inquiry to receive pricing and availability for the 5SGXMA9N3F45C2N.