5SGXMA9N2F45I3N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA

Quantity 1,122 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs317000Number of Logic Elements/Cells840000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMA9N2F45I3N – Stratix® V GX FPGA, 840,000 logic elements

The 5SGXMA9N2F45I3N is a Stratix® V GX field programmable gate array (FPGA) offered in an industrial temperature grade. It provides a high logic element count along with large on-chip RAM and extensive I/O, packaged in a high-density 1932-ball BGA.

This device targets designs requiring large programmable logic capacity, significant embedded memory, and a broad I/O complement, while operating across an industrial temperature range and RoHS-compliant manufacturing.

Key Features

  • Core logic  Provides 840,000 logic elements for large-scale programmable logic implementations.
  • Embedded memory  Includes approximately 53.248 Mbits of on-chip RAM to support data buffering, FIFOs, and large state storage.
  • I/O capacity  Offers 840 I/Os to interface with a wide range of peripherals and system fabrics.
  • Power  Operates from a documented supply range of 820 mV to 880 mV for core voltage planning and power budgeting.
  • Package & mounting  Supplied in a 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount type designed for PCB integration.
  • Temperature & grade  Industrial-grade device with an operating temperature range of –40°C to 100°C for demanding environments.
  • Compliance  RoHS compliant to support regulated manufacturing and assembly requirements.

Unique Advantages

  • High programmable density: 840,000 logic elements provide the capacity to implement complex algorithms, large state machines, and sizable custom datapaths without external logic.
  • Substantial on-chip RAM: Approximately 53.248 Mbits of embedded memory reduce reliance on external memory for many buffering and storage needs, simplifying board design.
  • Extensive I/O available: 840 I/O pins enable broad system connectivity and flexible interfacing to peripherals and other system components.
  • Industrial temperature rating: Rated from –40°C to 100°C to support deployments in industrial and temperature-variable environments.
  • High-density BGA package: 1932-ball FCBGA (45×45) packaging delivers compact integration for space-constrained PCBs while maintaining high pin count.

Why Choose 5SGXMA9N2F45I3N?

The 5SGXMA9N2F45I3N combines very high logic capacity, large embedded RAM, and a broad I/O complement in an industrial-grade Stratix V GX FPGA. Its core voltage and thermal ratings make it suitable for designs that require predictable power planning and operation across wide temperature ranges.

This device is suited to teams and systems that need a scalable, high-density programmable platform with extensive on-chip resources and a high pin-count package, offering design flexibility and integration potential while adhering to RoHS compliance.

Request a quote or submit a product inquiry to obtain pricing, availability, and ordering information for the 5SGXMA9N2F45I3N.

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