5SGXMA9N2F45I3N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 53248000 840000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,122 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 317000 | Number of Logic Elements/Cells | 840000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMA9N2F45I3N – Stratix® V GX FPGA, 840,000 logic elements
The 5SGXMA9N2F45I3N is a Stratix® V GX field programmable gate array (FPGA) offered in an industrial temperature grade. It provides a high logic element count along with large on-chip RAM and extensive I/O, packaged in a high-density 1932-ball BGA.
This device targets designs requiring large programmable logic capacity, significant embedded memory, and a broad I/O complement, while operating across an industrial temperature range and RoHS-compliant manufacturing.
Key Features
- Core logic Provides 840,000 logic elements for large-scale programmable logic implementations.
- Embedded memory Includes approximately 53.248 Mbits of on-chip RAM to support data buffering, FIFOs, and large state storage.
- I/O capacity Offers 840 I/Os to interface with a wide range of peripherals and system fabrics.
- Power Operates from a documented supply range of 820 mV to 880 mV for core voltage planning and power budgeting.
- Package & mounting Supplied in a 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount type designed for PCB integration.
- Temperature & grade Industrial-grade device with an operating temperature range of –40°C to 100°C for demanding environments.
- Compliance RoHS compliant to support regulated manufacturing and assembly requirements.
Unique Advantages
- High programmable density: 840,000 logic elements provide the capacity to implement complex algorithms, large state machines, and sizable custom datapaths without external logic.
- Substantial on-chip RAM: Approximately 53.248 Mbits of embedded memory reduce reliance on external memory for many buffering and storage needs, simplifying board design.
- Extensive I/O available: 840 I/O pins enable broad system connectivity and flexible interfacing to peripherals and other system components.
- Industrial temperature rating: Rated from –40°C to 100°C to support deployments in industrial and temperature-variable environments.
- High-density BGA package: 1932-ball FCBGA (45×45) packaging delivers compact integration for space-constrained PCBs while maintaining high pin count.
Why Choose 5SGXMA9N2F45I3N?
The 5SGXMA9N2F45I3N combines very high logic capacity, large embedded RAM, and a broad I/O complement in an industrial-grade Stratix V GX FPGA. Its core voltage and thermal ratings make it suitable for designs that require predictable power planning and operation across wide temperature ranges.
This device is suited to teams and systems that need a scalable, high-density programmable platform with extensive on-chip resources and a high pin-count package, offering design flexibility and integration potential while adhering to RoHS compliance.
Request a quote or submit a product inquiry to obtain pricing, availability, and ordering information for the 5SGXMA9N2F45I3N.

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