5SGXMA9N2F45I2G

The 5SGXMA9N2F45I2G is a Stratix® V GX field programmable gate array (FPGA) IC from Intel, offered in a 1932-BBGA FCBGA package for surface-mount applications. It delivers a high-density programmable fabric with large on-chip memory and extensive I/O for complex, interface-rich system designs.

Designed for industrial-grade deployments, this device combines 840,000 logic elements, approximately 53.25 Mbits of embedded memory, and 840 I/O pins, enabling implementation of large-scale logic, memory-intensive functions, and high‑pin-count system integration within a single device.

Key Features

• Core Capacity — 840,000 logic elements to support large, complex designs and high gate-count implementations.
• Logic Clusters — 317,000 logic-element clusters to organize and map sizable logic resources efficiently.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for buffering, storage, and memory‑centric architectures.
• I/O Density — 840 programmable I/O pins to support multiple parallel interfaces and high-port-count systems.
• Power — Operates from a core supply range of 870 mV to 930 mV to meet device operating requirements.
• Package & Mounting — 1932-BBGA (FCBGA) package, supplier package listed as 1932-FBGA, FC (45×45), intended for surface-mount assembly.
• Temperature & Grade — Industrial grade operation with an operating temperature range of -40 °C to 100 °C for deployment in demanding environments.
• Stratix V GX Family — Part of the Stratix V GX device family as documented in the Stratix V device datasheet, supporting the electrical and switching characteristics defined for the series.

Typical Applications

• High-density logic implementations — Use the abundant logic elements and clusters to consolidate complex algorithms, custom accelerators, or large combinational/sequential logic blocks.
• Memory‑intensive designs — Leverage approximately 53.25 Mbits of embedded RAM for buffering, packet memory, or intermediate data storage within high-throughput flows.
• High‑pin-count interface aggregation — Utilize 840 I/O pins to integrate multiple parallel interfaces, bridging subsystems or aggregating I/O in communication and processing systems.

Unique Advantages

• Large programmable fabric: 840,000 logic elements provide the capacity to implement complex systems-on-chip and extensive custom logic integration.
• Substantial embedded memory: Approximately 53.25 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
• Extensive I/O: 840 I/Os enable dense connectivity and flexible interface mapping for high‑port-count applications.
• Industrial temperature rating: Rated for -40 °C to 100 °C operation to support deployment in industrial environments.
• Compact package with surface-mount mounting: 1932-BBGA (FCBGA) packaging provides high integration density suitable for space-constrained PCBs.

Why Choose 5SGXMA9N2F45I2G?

The 5SGXMA9N2F45I2G delivers a high-capacity Stratix V GX FPGA solution that balances large logic capacity, significant embedded memory, and high I/O density in an industrial-grade, surface-mount package. Its specification set makes it well suited for engineers building complex, memory‑heavy, and interface-dense systems that require consolidated programmable logic.

As part of the Stratix V family, this device aligns with the documented electrical and switching characteristics of the series, offering a clear specification baseline for system-level design and long-term deployment considerations.

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