5SGXMA9K3H40I3NCV

The 5SGXMA9K3H40I3NCV is a Stratix® V GX Field Programmable Gate Array (FPGA) IC in an industrial-grade, surface-mount package. It integrates approximately 840,000 logic elements and roughly 53 Mbits of embedded memory, making it suitable for complex, high-density digital designs that require significant on-chip logic and memory resources.

Key physical and electrical characteristics include 696 user I/Os, a core supply range of 820 mV to 880 mV, and an operating temperature range of –40°C to 100°C. The device is supplied in a 1517-BBGA FCBGA package (supplier package: 1517-HBGA, 45×45) and is RoHS compliant.

Key Features

• Core and Logic  Approximately 840,000 logic elements for large-scale digital integration and complex algorithm implementation.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive functions.
• I/O Density  696 user I/Os to interface with multiple peripherals, high-pin-count daughtercards, or dense backplane connections.
• Package and Mounting  Delivered in a 1517-BBGA (FCBGA) package; supplier device package noted as 1517-HBGA (45×45); surface-mount mounting for board-level assembly.
• Power and Voltage  Core supply range of 820 mV to 880 mV to match system power-rail planning for modern FPGA core voltages.
• Temperature and Grade  Industrial temperature grade with an operating range of –40°C to 100°C for elevated ambient environments.
• Compliance  RoHS compliant to meet common environmental and regulatory requirements.
• Stratix V GX Family Transceiver Capability (datasheet)  The Stratix V GX family includes transceiver speed grades described in the device datasheet (family support includes GX channel grades up to 14.1 Gbps), enabling high-speed serial connectivity in designs that require it.

Typical Applications

• High-bandwidth communications and networking  The combination of large logic capacity, substantial embedded memory, and family transceiver speed grades supports implementations of high-throughput packet processing and line-card functions.
• Data processing and signal handling  Large on-chip logic and memory resources enable complex signal processing pipelines, real-time data aggregation, and protocol handling.
• Platform and system integration  High I/O density and the 45×45 package footprint support dense board-level integration and multi-board systems where many external interfaces are required.

Unique Advantages

• High integration density: Approximately 840,000 logic elements reduce the need for multiple devices by consolidating complex logic into a single FPGA.
• Significant on-chip memory: Approximately 53 Mbits of embedded RAM simplifies buffering and state storage without external memory dependencies.
• Extensive I/O capability: 696 user I/Os provide flexibility for connecting to large numbers of peripherals, sensors, or high-speed interfaces.
• Industrial temperature rating: Specified operation from –40°C to 100°C supports deployment in demanding thermal environments.
• Compact BGA packaging: 1517-BBGA (supplier 1517-HBGA, 45×45) supports high-density PCB layout while remaining surface-mount compatible.
• Compliance-ready: RoHS compliance aligns with common environmental requirements for procurement and manufacturing.

Why Choose 5SGXMA9K3H40I3NCV?

The 5SGXMA9K3H40I3NCV delivers a balance of high logic capacity, substantial embedded memory, and broad I/O in an industrial-grade Stratix V GX FPGA. Its specifications suit designs that demand on-chip integration of large digital functions, significant buffering, and many external interfaces, while operating across industrial temperature ranges.

Choose this device when your project requires consolidation of complex logic into a single FPGA footprint, robust on-chip memory resources, and the ability to leverage Stratix V GX family transceiver capabilities as described in the device datasheet. The combination of package density, RoHS compliance, and defined electrical parameters supports long-term design planning and system-level integration.

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