A3P030-1QNG68

The A3P030-1QNG68 is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology featuring 768 logic elements (cells) and approximately 30,000 gates. Packaged in a 68‑VFQFN exposed pad (supplier package: 68‑QFN, 8×8) with surface-mount mounting, it is offered as a commercial‑grade device.

With 49 I/O pins, a core supply range of 1.425 V to 1.575 V, and an operating temperature range of 0 °C to 85 °C, this device addresses commercial embedded designs that require moderate logic density and a compact QFN footprint.

Key Features

• Core Logic 768 logic elements (cells) providing approximately 30,000 gates for implementing custom digital logic.
• I/O 49 I/O pins to connect with peripherals and external devices.
• Memory No embedded RAM on‑chip (Total RAM Bits: 0), suitable for designs relying on distributed logic or external memory.
• Power Core voltage supply range from 1.425 V to 1.575 V for stable device operation within the specified supply window.
• Package and Mounting 68‑VFQFN with exposed pad; supplier device package listed as 68‑QFN (8×8). Surface‑mount mounting supports compact PCB implementations.
• Operating Conditions Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Commercial embedded systems — Implement moderate-density logic functions where a compact QFN package and 49 I/O pins meet system integration needs.
• I/O expansion and glue logic — Use the FPGA's logic elements and available I/O to consolidate discrete logic and interface functions on the board.
• Low‑ to mid‑density programmable logic — Deploy for designs that require up to ~30,000 gates of custom digital logic in a surface‑mount form factor.

Unique Advantages

• Right‑sized logic density: 768 logic elements and ~30,000 gates provide a clear target for moderate complexity designs without excess resources.
• Compact QFN footprint: 68‑VFQFN / 68‑QFN (8×8) package enables space‑constrained PCB layouts while providing an exposed pad for board attachment.
• Clear power envelope: Narrow core supply range (1.425 V–1.575 V) simplifies power supply design and verification for the FPGA core.
• Commercial rating: Specified 0 °C to 85 °C operating range aligns with a wide set of commercial applications and deployments.
• Regulatory compliance: RoHS compliance supports modern manufacturing and regulatory requirements.

Why Choose A3P030-1QNG68?

The A3P030-1QNG68 offers a balanced combination of moderate logic capacity, a 49‑pin I/O complement, and a compact 68‑VFQFN package suited to commercial embedded applications. Its defined core voltage range and commercial temperature rating make it a practical choice for designers targeting board‑level integration with clear electrical and thermal mounting considerations.

This device is appropriate for engineering teams who require a programmable logic solution with predictable resource counts, a small package footprint, and RoHS compliance. Its specification set supports reliable deployment in commercial product lines where moderate programmable logic and I/O capability are required.

Request a quote or contact sales to discuss availability, pricing, and how the A3P030-1QNG68 can fit into your next design.