5SGXMBBR3H43I4G

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 952000 1760-BBGA, FCBGA

Quantity 427 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMBBR3H43I4G – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXMBBR3H43I4G is a Stratix V GX family FPGA from Intel, delivering large on-chip logic and memory capacity in a high-density BGA package. It is designed for industrial-grade applications that require substantial programmable logic, significant embedded RAM, and a high I/O count.

Key Features

  • Core Logic Capacity — 952,000 logic elements to implement complex digital designs and large-scale programmable logic functions.
  • Embedded Memory — Approximately 53.2 Mbits of on-chip RAM for buffering, lookup tables, and data storage within the fabric.
  • I/O Density — 600 user I/O pins to support multiple interfaces and parallel connectivity requirements.
  • Voltage Supply — Core operating range of 820 mV to 880 mV for the device core supply.
  • Package & Mounting — 1760-BBGA FCBGA package (supplier device package: 1760-HBGA, 45×45) with surface-mount mounting for high-density board integration.
  • Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for demanding environments.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Industrial Control & Automation — Use the device’s industrial temperature rating, wide I/O count, and large logic capacity to implement custom controllers, protocol bridging, and real-time processing in industrial systems.
  • High-density Signal Processing — Large logic and on-chip RAM support streaming data handling, buffering, and complex signal processing pipelines.
  • Networking & Communications — High I/O availability and substantial programmable resources enable implementation of custom packet processing, protocol handling, and interface aggregation.
  • Prototyping & System Integration — Compact FCBGA packaging and extensive logic resources make the device suitable for high-capacity prototype boards and integration into production systems.

Unique Advantages

  • High Logic Density: 952,000 logic elements enable large-scale designs without immediate upscaling to multiple devices.
  • Substantial On-chip Memory: Approximately 53.2 Mbits of embedded RAM reduces dependency on external memory for many buffering and table-based functions.
  • Extensive I/O: 600 I/O pins provide flexibility to interface with multiple peripherals, transceivers, and parallel buses.
  • Industrial-ready Thermal Range: Rated for −40 °C to 100 °C operation to meet the environmental demands of industrial deployments.
  • Compact, High-density Package: 1760-BBGA (FCBGA) in a 45×45 supplier package supports dense PCB layouts while accommodating high signal counts.
  • Defined Core Supply Range: 820 mV–880 mV core voltage provides clear electrical parameters for power supply design and verification.

Why Choose 5SGXMBBR3H43I4G?

The 5SGXMBBR3H43I4G combines a very large pool of logic elements and substantial embedded memory with a high I/O count and industrial temperature rating, making it well suited to designers building complex, high-density programmable systems. As a member of the Intel Stratix V GX family, it brings a defined core supply range and a compact 1760-BBGA package for integration into production and industrial platforms.

This device is targeted at teams requiring scalable programmable logic capacity, significant on-chip RAM, and robust I/O in an industrial-grade FPGA. Its specification set supports long-term deployment scenarios where temperature range, integration density, and measurable electrical parameters are key selection criteria.

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