5SGXMBBR3H43I4G
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 952000 1760-BBGA, FCBGA |
|---|---|
| Quantity | 427 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1760-HBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1760-BBGA, FCBGA | Number of I/O | 600 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 359200 | Number of Logic Elements/Cells | 952000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 53248000 |
Overview of 5SGXMBBR3H43I4G – Stratix® V GX Field Programmable Gate Array (FPGA) IC
The 5SGXMBBR3H43I4G is a Stratix V GX family FPGA from Intel, delivering large on-chip logic and memory capacity in a high-density BGA package. It is designed for industrial-grade applications that require substantial programmable logic, significant embedded RAM, and a high I/O count.
Key Features
- Core Logic Capacity — 952,000 logic elements to implement complex digital designs and large-scale programmable logic functions.
- Embedded Memory — Approximately 53.2 Mbits of on-chip RAM for buffering, lookup tables, and data storage within the fabric.
- I/O Density — 600 user I/O pins to support multiple interfaces and parallel connectivity requirements.
- Voltage Supply — Core operating range of 820 mV to 880 mV for the device core supply.
- Package & Mounting — 1760-BBGA FCBGA package (supplier device package: 1760-HBGA, 45×45) with surface-mount mounting for high-density board integration.
- Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for demanding environments.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Industrial Control & Automation — Use the device’s industrial temperature rating, wide I/O count, and large logic capacity to implement custom controllers, protocol bridging, and real-time processing in industrial systems.
- High-density Signal Processing — Large logic and on-chip RAM support streaming data handling, buffering, and complex signal processing pipelines.
- Networking & Communications — High I/O availability and substantial programmable resources enable implementation of custom packet processing, protocol handling, and interface aggregation.
- Prototyping & System Integration — Compact FCBGA packaging and extensive logic resources make the device suitable for high-capacity prototype boards and integration into production systems.
Unique Advantages
- High Logic Density: 952,000 logic elements enable large-scale designs without immediate upscaling to multiple devices.
- Substantial On-chip Memory: Approximately 53.2 Mbits of embedded RAM reduces dependency on external memory for many buffering and table-based functions.
- Extensive I/O: 600 I/O pins provide flexibility to interface with multiple peripherals, transceivers, and parallel buses.
- Industrial-ready Thermal Range: Rated for −40 °C to 100 °C operation to meet the environmental demands of industrial deployments.
- Compact, High-density Package: 1760-BBGA (FCBGA) in a 45×45 supplier package supports dense PCB layouts while accommodating high signal counts.
- Defined Core Supply Range: 820 mV–880 mV core voltage provides clear electrical parameters for power supply design and verification.
Why Choose 5SGXMBBR3H43I4G?
The 5SGXMBBR3H43I4G combines a very large pool of logic elements and substantial embedded memory with a high I/O count and industrial temperature rating, making it well suited to designers building complex, high-density programmable systems. As a member of the Intel Stratix V GX family, it brings a defined core supply range and a compact 1760-BBGA package for integration into production and industrial platforms.
This device is targeted at teams requiring scalable programmable logic capacity, significant on-chip RAM, and robust I/O in an industrial-grade FPGA. Its specification set supports long-term deployment scenarios where temperature range, integration density, and measurable electrical parameters are key selection criteria.
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