A3P030-1QNG48I

IC FPGA 34 I/O 48QFN
Part Description

ProASIC3 Field Programmable Gate Array (FPGA) IC 34 48-VFQFN Exposed Pad

Quantity 174 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package48-QFN (6x6)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case48-VFQFN Exposed PadNumber of I/O34Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs768Number of Logic Elements/Cells768
Number of Gates30000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A3P030-1QNG48I – ProASIC3 Field Programmable Gate Array (FPGA) IC 34 48-VFQFN Exposed Pad

The A3P030-1QNG48I is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology, offered in a compact 48-VFQFN exposed pad package. It provides a mid-range programmable logic resource set — approximately 768 logic elements (about 30,000 gates) and 34 user I/Os — suitable for industrial applications that require a small-footprint, surface-mount FPGA with defined power and thermal limits.

Designed for applications operating from a 1.425 V to 1.575 V supply and rated for an operating temperature range of −40 °C to 100 °C, this device targets embedded and industrial designs that need predictable electrical characteristics and a condensed package footprint.

Key Features

  • Logic Capacity  Approximately 768 logic elements delivering roughly 30,000 gates for implementing custom combinational and sequential logic.
  • I/O Resources  34 user I/Os to support peripheral interfaces, signal conditioning, and interconnect functions in compact designs.
  • Power  Specified operating supply range of 1.425 V to 1.575 V to guide power-supply design and margining.
  • Package and Mounting  48-VFQFN exposed pad (48-QFN, 6×6 mm) surface-mount package that minimizes PCB area while providing thermal return through the exposed pad.
  • Industrial Grade Temperature  Operation from −40 °C to 100 °C to meet a wide range of industrial environmental conditions.
  • Environmental Compliance  RoHS compliant, supporting environmental and regulatory requirements for lead-free assemblies.

Typical Applications

  • Industrial Control  Implement control logic, timing, and signal sequencing in industrial equipment using the device’s logic capacity and industrial temperature rating.
  • Embedded Systems  Integrate custom logic and interface glue in compact embedded products where board space and predictable supply voltage are important.
  • I/O Bridging and Protocol Adaptation  Use the 34 I/Os to implement protocol translation, buffering, and interface bridging between system components.
  • Prototyping and Low-to-Mid Complexity Designs  Rapidly prototype or deploy low-to-mid complexity programmable logic functions with a compact QFN package footprint.

Unique Advantages

  • Compact, PCB-friendly package: The 48-VFQFN exposed pad and 6×6 mm QFN footprint help minimize board area while offering thermal return through the exposed pad.
  • Targeted logic capacity: Approximately 768 logic elements (~30,000 gates) provides a clear sizing point for low-to-mid complexity designs without overspecifying resources.
  • Predictable power requirements: A narrow supply range of 1.425 V to 1.575 V simplifies power rail design and margin planning.
  • Industrial temperature range: Rated from −40 °C to 100 °C to support deployments in demanding environmental conditions.
  • RoHS compliant: Conforms to lead-free assembly requirements for modern manufacturing processes.

Why Choose A3P030-1QNG48I?

The A3P030-1QNG48I positions itself as a compact, industrial-grade ProASIC3 FPGA option that balances a defined logic element count and a modest I/O set within a small QFN footprint. Its narrow supply voltage window and wide operating temperature range make it a suitable choice for engineers seeking predictable electrical behavior and reliable thermal performance in constrained form factors.

This device is well suited for designers implementing low-to-mid complexity programmable logic, interface bridging, and embedded control functions where board space, industrial temperature capability, and compliance with RoHS are priorities. Backed by Microchip Technology’s ProASIC3 family documentation, it provides a clearly specified option for production and prototyping environments.

Request a quote or submit an RFQ to evaluate the A3P030-1QNG48I for your next embedded or industrial design project.

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