5SGXMBBR3H43I3N

The 5SGXMBBR3H43I3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for industrial-grade applications. It provides large on-chip logic and memory resources, a high I/O count, and a compact FCBGA/HBGA package suitable for surface-mount assembly.

This device targets complex digital systems that require substantial embedded memory, extensive I/O capability, and operation across a broad industrial temperature range.

Key Features

• Logic Capacity — 952,000 logic elements, enabling large-scale digital implementation and complex system integration.
• Embedded Memory — Approximately 53.2 Mbits of total on-chip RAM bits for buffering, FIFOs, and large data structures.
• I/O — 600 user I/O pins to support dense external interfacing and multi-channel connectivity.
• Power Supply — Core voltage supply range from 820 mV to 880 mV for compatibility with low-voltage power domains.
• Package — 1760-BBGA, FCBGA footprint with a supplier device package listed as 1760-HBGA (45×45), optimized for high-density board designs.
• Operating Environment — Industrial temperature grade with an operating range of −40 °C to 100 °C for rugged deployments.
• Mounting — Surface mount device suitable for standard PCB assembly processes.
• Standards & Compliance — RoHS compliant.

Typical Applications

• High-density signal processing — Implement large custom datapaths and accelerator logic using the device’s extensive logic element and embedded memory resources.
• Telecommunications and networking — Use the high I/O count to interface with multi-lane backplanes, PHYs, and network peripherals.
• Data acquisition and instrumentation — Leverage on-chip RAM and abundant logic for real-time buffering, preprocessing, and control functions in industrial measurement systems.
• Embedded compute platforms — Integrate custom compute and control logic while maintaining compact board footprint with the 1760-BBGA package.

Unique Advantages

• Large programmable fabric — 952,000 logic elements provide the scale required for complex SoC-style FPGA implementations without external logic.
• Substantial embedded memory — Approximately 53.2 Mbits of on-chip RAM simplifies system memory architecture and reduces the need for external memory in many designs.
• Extensive I/O flexibility — 600 I/O pins enable robust interfacing options for multi-channel systems and dense peripheral connectivity.
• Industrial temperature rating — −40 °C to 100 °C operating range supports deployment in harsh and temperature-variable environments.
• Compact, assembly-ready package — 1760-BBGA / 1760-HBGA (45×45) package offers high pin density in a surface-mount form factor for space-constrained PCBs.
• Low-voltage core operation — 820 mV to 880 mV supply compatibility for modern low-voltage power domains and power-optimized system architectures.

Why Choose 5SGXMBBR3H43I3N?

This Stratix V GX FPGA part balances very large logic capacity, significant embedded memory, and a high I/O count in an industrial-grade, surface-mount package. It is well suited for engineering teams building complex digital systems that require on-chip resources and robust environmental performance.

For designs that demand scalability, dense interfacing, and reliable operation across a wide temperature range, the 5SGXMBBR3H43I3N offers a clear platform-level option with verifiable specifications for integration and procurement.

If you need pricing, availability, or lead-time information, request a quote or submit an inquiry to receive a tailored response for your project requirements.