5SGXMBBR3H43C4N

IC FPGA 600 I/O 1760HBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 600 53248000 952000 1760-BBGA, FCBGA

Quantity 574 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1760-HBGA (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1760-BBGA, FCBGANumber of I/O600Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs359200Number of Logic Elements/Cells952000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits53248000

Overview of 5SGXMBBR3H43C4N – Stratix® V GX FPGA, 952,000 logic elements, 600 I/O, 1760‑BBGA

The 5SGXMBBR3H43C4N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for high‑density, high‑I/O digital designs. As a member of the Stratix V GX family, it combines a large logic fabric with substantial on‑chip RAM and a high pin count to support complex, integration‑intensive applications.

Key technical attributes include 952,000 logic elements, approximately 53.2 Mbits of embedded memory, up to 600 I/O, and a commercial temperature grade (0 °C to 85 °C). The device operates with a core supply in the 820 mV to 880 mV range and is supplied in a 1760‑BBGA (FCBGA) surface‑mount package.

Key Features

  • Core & Logic 952,000 logic elements provide very high gate count capacity for large, parallel logic implementations and complex processing pipelines.
  • On‑chip Memory Approximately 53.2 Mbits of embedded memory to support buffering, large LUTs, and data‑intensive algorithms without external RAM.
  • I/O Density Up to 600 general‑purpose I/O pins to interface with multiple peripherals, wide parallel buses, and high‑bandwidth I/O requirements.
  • Transceiver Capability (Stratix V GX family) Stratix V GX devices include transceiver speed grade options in the family (up to the GX channel grades listed in the device datasheet), enabling high‑speed serial links where required by system design.
  • Low‑Voltage Core Supply Core voltage range of 820 mV to 880 mV for modern low‑voltage FPGA power domains and efficient core operation.
  • Package & Mounting 1760‑BBGA (FCBGA) surface‑mount package (supplier package 1760‑HBGA, 45×45 mm) suited for compact, dense PCB implementations.
  • Commercial Temperature Grade Rated for 0 °C to 85 °C operation for standard commercial applications.
  • RoHS Compliant Meets RoHS requirements for lead‑free manufacturing and assembly processes.

Typical Applications

  • High‑density digital processing — Leverages 952,000 logic elements and approximately 53.2 Mbits of embedded memory to implement large state machines, DSP pipelines, and custom compute fabrics.
  • High‑I/O systems — Up to 600 I/O pins enable wide parallel interfaces, multi‑lane data aggregation, and extensive peripheral connectivity.
  • High‑bandwidth serial interfaces — Stratix V GX family transceiver capabilities (as documented in the device datasheet) support implementation of high‑speed serial links for communications and data transport.
  • System integration and prototyping — Dense logic and memory on a single device simplify multi‑function integration for prototyping and production systems that require consolidation of IP blocks.

Unique Advantages

  • Extensive logic capacity: 952,000 logic elements enable integration of multiple complex subsystems on one device, reducing board‑level component count.
  • Substantial embedded memory: Approximately 53.2 Mbits of on‑chip RAM minimizes dependence on external memory for buffering and local storage.
  • High pin count: 600 I/O pins provide flexibility to connect numerous sensors, interfaces, and external devices without external multiplexing.
  • Low core voltage operation: 820 mV–880 mV core supply range supports modern low‑power FPGA power architectures.
  • Commercial‑grade reliability: Specified for 0 °C to 85 °C operation, aligning with standard commercial deployments.
  • Manufacturing‑friendly package: 1760‑BBGA surface‑mount package offers a compact footprint for high‑density PCB layouts.

Why Choose 5SGXMBBR3H43C4N?

The 5SGXMBBR3H43C4N delivers a combination of very high logic capacity, significant on‑chip memory, and broad I/O resources in a single Stratix V GX FPGA. Its low core voltage operation and surface‑mount 1760‑BBGA packaging make it suitable for dense, performance‑oriented commercial designs that require integrated logic and memory with extensive external connectivity.

Designers targeting complex digital systems, high‑bandwidth interfaces, or consolidation of multiple functions onto one device will find the 5SGXMBBR3H43C4N well matched to applications that demand large programmable fabric, embedded RAM capacity, and a high I/O count, supported by Stratix V family documentation and specifications.

Request a quote or submit a pricing and availability inquiry to get component details and lead‑time information for the 5SGXMBBR3H43C4N.

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