5SGXMBBR3H43C2LN

The 5SGXMBBR3H43C2LN is a Stratix® V GX field-programmable gate array (FPGA) IC supplied in a 1760‑BBGA (FCBGA) package. It provides a large programmable fabric with 952,000 logic elements and approximately 53.25 Mbits of on-chip RAM, delivering capacity for complex, high-density digital designs.

Targeted at commercial-grade applications, this device combines high logic density, extensive I/O, and a low-voltage core supply to support demanding system integration and performance-focused designs within a 0 °C to 85 °C operating range.

Key Features

• Logic Capacity — 952,000 logic elements to implement large-scale digital functions and complex processing pipelines.
• Embedded Memory — Approximately 53.25 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive blocks.
• I/O Resources — 600 I/O pins for broad external device interfacing and system-level connectivity.
• Core Voltage — Low-voltage core supply rated 820 mV to 880 mV to match system power domains and support power-optimized designs.
• Package & Mounting — 1760‑BBGA, FCBGA package (supplier device package: 1760‑HBGA, 45×45) with surface-mount mounting for dense board integration.
• Commercial Grade — Device specified for commercial temperature operation with an operating range of 0 °C to 85 °C.
• Standards Compliance — RoHS compliant.

Typical Applications

• High‑Performance Data Processing — Implement large custom accelerators, packet processing, or protocol offload engines using the device’s abundant logic and memory.
• Communications Systems — Use the high I/O count and dense logic fabric for data plane and control plane functions in networking equipment and link-layer processing.
• Prototyping & System Integration — Integrate multiple functions into a single FPGA for rapid prototyping and consolidation of board-level components.
• ASIC Emulation and Verification — Deploy the device for large-scale emulation tasks and hardware verification that require substantial logic and memory resources.

Unique Advantages

• Large Programmable Fabric: 952,000 logic elements enable implementation of complex SoC-level functions and parallel processing architectures.
• Substantial On‑Chip Memory: Approximately 53.25 Mbits of embedded RAM reduce external memory dependency and improve latency for buffering and streaming tasks.
• Extensive I/O Count: 600 I/O pins simplify interfacing to multiple peripherals, transceivers, and board-level buses without external expanders.
• Low‑Voltage Core: 820 mV–880 mV supply range supports designs optimized for reduced core power and compatibility with low-voltage power domains.
• Commercial Temperature Support: Rated for 0 °C to 85 °C operation to meet standard commercial deployment requirements.
• Surface‑Mount, High‑Density Package: 1760‑BBGA FCBGA in a 45×45 supplier package enables compact, high-pin-count board layouts.

Why Choose 5SGXMBBR3H43C2LN?

The 5SGXMBBR3H43C2LN combines very large logic capacity and significant embedded memory with a high I/O count in a compact BGA package, making it well suited for designers who need to consolidate functions into a single FPGA or implement large, performance-sensitive designs. Its low-voltage core and commercial temperature rating align with power‑conscious, production-oriented applications.

This device is appropriate for engineering teams building high-density digital systems, communication platforms, or hardware verification environments that require reliable, scalable FPGA resources backed by the Stratix V family specifications.

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