5SGXMBBR2H43I3N

The 5SGXMBBR2H43I3N is a Stratix V GX Field Programmable Gate Array (FPGA) IC supplied in a 1760-BBGA (FCBGA) surface-mount package. It delivers substantial on-chip resources with 952,000 logic elements, approximately 53 Mbits of embedded memory, and 600 user I/Os.

Engineered for industrial-grade deployments, this device combines high-density logic, significant embedded RAM, and a wide operating temperature range to address demanding designs that require large-scale integration and robust environmental tolerance.

Key Features

• Core Capacity  952,000 logic elements for implementing complex digital logic and large-scale custom architectures.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM to support data buffering, frame storage, and large state machines without immediate external memory.
• I/O Density  600 general-purpose I/Os to interface with high-channel-count systems, wide parallel buses, and multiple peripherals.
• Package & Mounting  1760-BBGA, FCBGA (supplier package: 1760-HBGA, 45×45 mm) designed for surface-mount PCB assembly in compact, high-density designs.
• Power / Core Voltage  Core supply range of 820 mV to 880 mV for the device core power rail.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C for use in temperature-challenging environments.
• Regulatory Compliance  RoHS-compliant to meet environmental and lead-free assembly requirements.

Typical Applications

• High-density logic integration  Implement large custom datapaths, complex control logic, or multiple heterogeneous accelerators on a single device using available logic elements and embedded RAM.
• Network & communications  Use abundant I/Os and large logic capacity to build protocol bridges, packet processing, and multi-channel interface logic.
• Industrial control and automation  Leverage the device's industrial temperature rating and extensive I/O to drive sensor aggregation, motor control, and real-time control systems.
• System prototyping and FPGA-based processing  Deploy as a platform for complex algorithm prototyping that requires significant on-chip resources and I/O connectivity.

Unique Advantages

• High integration density: 952,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing system complexity.
• Substantial on-chip RAM: Approximately 53 Mbits of embedded memory supports large buffers and state storage without immediate reliance on external memory.
• Extensive I/O count: 600 I/Os provide flexibility for interfacing to many peripherals, buses, and parallel signals.
• Industrial robustness: Rated for –40 °C to 100 °C operation to address designs deployed in demanding environmental conditions.
• Compact BGA packaging: 1760-BBGA (45×45 mm supplier package) allows high-density PCB implementations with surface-mount assembly.
• RoHS compliant: Conforms to lead-free and environmental manufacturing requirements.

Why Choose 5SGXMBBR2H43I3N?

The 5SGXMBBR2H43I3N delivers a combination of large logic capacity, significant embedded memory, and high I/O count in a single industrial-grade FPGA package. These characteristics make it well suited for system designs that demand on-chip integration of complex logic, extensive buffering, and broad external connectivity within a compact surface-mount form factor.

For teams designing advanced industrial controllers, communication systems, or high-density processing platforms, this Stratix V GX device provides a scalable hardware foundation with verifiable operating and supply characteristics to support robust deployment and long-term product development.

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