5SGXMBBR2H43I2N

The 5SGXMBBR2H43I2N is an Intel Stratix® V GX field programmable gate array (FPGA) IC configured for industrial-grade deployments. The device combines a high logic-element count with substantial embedded RAM and a large I/O complement to support dense, complex FPGA designs.

Key silicon characteristics visible from the product data include 952,000 logic elements, approximately 53 Mbits of embedded memory, 600 general-purpose I/Os, a 1760‑BBGA FCBGA package footprint, and an industrial operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic Density  952,000 logic elements provide large programmable logic capacity for complex designs and system-level integration.
• On‑Chip Memory  Approximately 53 Mbits of embedded RAM for buffering, state storage, and data-path resources without external memory.
• I/O Capacity  600 I/O pins enable broad external connectivity and flexible interfacing across peripherals and board-level signals.
• Power Supply  Core voltage supply specified from 870 mV to 930 mV to match low-voltage core domains.
• Package & Mounting  1760‑BBGA FCBGA (supplier device package 1760‑HBGA, 45×45) in a surface-mount form factor for high‑density PCBs.
• Industrial Grade & Temperature  Rated as an industrial device with operating temperature range from −40 °C to 100 °C for thermally demanding environments.
• Regulatory Compliance  RoHS compliant for environmental and manufacturing process compliance.

Typical Applications

• High‑density logic and compute  Large FPGA fabric and substantial embedded RAM support designs that require significant on‑chip logic and memory resources.
• High‑pin‑count I/O systems  A 600‑pin I/O interface and BGA package suit multi‑interface systems and board layouts with extensive external connectivity.
• Industrial embedded systems  Industrial temperature rating (−40 °C to 100 °C) and RoHS compliance make the device suitable for industrial applications requiring extended temperature operation.

Unique Advantages

• High integration density: 952,000 logic elements and approximately 53 Mbits of embedded memory reduce reliance on external logic and memory components.
• Extensive external connectivity: 600 I/Os simplify integration with multiple peripherals, sensors, and high‑pin‑count boards.
• Compact, manufacturable package: 1760‑BBGA (45×45) surface-mount package supports compact PCB layouts and automated assembly.
• Industrial temperature capability: Rated from −40 °C to 100 °C to meet environmental expectations for industrial deployments.
• Low‑voltage core operation: Core supply range of 870 mV to 930 mV aligns with modern low‑voltage FPGA domains.
• RoHS compliance: Conforms to RoHS for environmentally responsible manufacturing.

Why Choose 5SGXMBBR2H43I2N?

The 5SGXMBBR2H43I2N positions itself as a high‑density, industrial‑grade Stratix V GX FPGA option combining nearly one million logic elements, a large block of embedded RAM, and a 600‑pin I/O complement in a 1760‑BBGA surface‑mount package. These measurable attributes make it suitable for designs that require significant on‑chip resources, broad connectivity, and reliable operation across an extended temperature range.

Designers seeking a scalable FPGA fabric with substantial embedded memory and I/O capacity will find this device applicable to complex system designs where integration density, thermal range, and RoHS compliance are required.

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