5SGXMBBR2H43I2LG

The 5SGXMBBR2H43I2LG is a Stratix® V GX Field Programmable Gate Array (FPGA) IC in a 1760‑BBGA (FCBGA) package. It delivers a high-density programmable fabric with 952,000 logic elements and approximately 53 Mbits of embedded memory, supporting designs that require substantial on-chip logic and storage.

Designed for industrial temperature operation (‑40 °C to 100 °C), this surface‑mount device offers up to 600 I/O pins and a core voltage supply range of 0.82–0.88 V, making it suitable for robust, high-density system designs where integration and thermal headroom matter.

Key Features

• Core & Logic 952,000 logic elements provide a large programmable fabric for complex logic, DSP, and custom compute functions.
• Embedded Memory Approximately 53 Mbits of on-chip RAM for buffering, packet processing, and algorithm state storage.
• I/O Density Up to 600 available I/O pins to support wide peripheral connectivity and multi-channel interfaces.
• Power Core supply voltage range of 0.82–0.88 V to match platform power-rail requirements.
• Package & Mounting 1760‑BBGA (FCBGA) package; supplier device package listed as 1760‑HBGA (45×45). Surface‑mount mounting for PCB integration.
• Temperature & Grade Industrial grade device rated for operation from ‑40 °C to 100 °C.
• Family Documentation Part of the Stratix V series; consult the Stratix V device datasheet for family electrical and switching characteristics, including transceiver speed grade information.

Typical Applications

• High‑density digital processing — Implement large custom logic blocks, accelerators, and algorithmic datapaths using the extensive logic element count and on‑chip RAM.
• Telecom & Networking — Support multi‑channel I/O and high integration needs for packet processing, protocol offload, and interface bridging.
• Data Center & Compute — Use as a reconfigurable component for hardware acceleration, buffering, and custom I/O aggregation.

Unique Advantages

• High programmable density: 952,000 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level component count.
• Substantial embedded memory: Approximately 53 Mbits of on‑chip RAM provides local storage for real‑time buffering and state management without external memories.
• Large I/O complement: Up to 600 I/Os simplify multi-interface designs and reduce the need for additional I/O expansion components.
• Industrial temperature rating: Rated for ‑40 °C to 100 °C to meet a wide range of environmental requirements for industrial deployments.
• Compact, surface‑mount packaging: 1760‑BBGA (FCBGA) / 1760‑HBGA (45×45) package supports high signal density in space-constrained PCBs.
• Documented family characteristics: Backed by the Stratix V device datasheet for electrical and switching characteristic reference during design and validation.

Why Choose 5SGXMBBR2H43I2LG?

This Stratix® V GX device targets designs that require a large on‑chip logic capacity, significant embedded memory, and high I/O density within an industrial temperature envelope. Its combination of 952,000 logic elements, roughly 53 Mbits of RAM, and 600 I/Os in a 1760‑BBGA package makes it suitable for engineers building complex, integrated solutions where consolidation and reliability are priorities.

Choosing the 5SGXMBBR2H43I2LG delivers a scalable FPGA platform grounded in Stratix V family documentation, enabling deterministic electrical and switching behavior backed by vendor datasheet specifications.

Request a quote or submit an inquiry to learn more about availability, packaging options, and ordering for the 5SGXMBBR2H43I2LG.