5SGXMBBR2H43I2LN

The 5SGXMBBR2H43I2LN is a Stratix® V GX field programmable gate array (FPGA) offered in a 1760-BBGA (FCBGA) package. It delivers very high logic capacity and on‑chip memory for designs that require large programmable logic fabric and broad I/O integration.

Designed for industrial temperature operation, this device combines up to 952,000 logic elements, approximately 53 Mbits of embedded RAM, and 600 user I/O pins, enabling dense, high-I/O designs with a compact surface-mount package.

Key Features

• Core / Logic  Up to 952,000 logic elements to support large-scale programmable logic implementations and complex system integration.
• Embedded Memory  Approximately 53 Mbits of on-chip RAM (53,248,000 bits) for data buffering, FIFOs, and embedded storage without external memory.
• I/O Capacity  600 user I/O pins to support wide parallel interfaces, high port-count systems, and extensive peripheral connectivity.
• Power Supply  Core voltage supply range of 820 mV to 880 mV to match system power architecture requirements.
• Package & Mounting  1760-BBGA (FCBGA) package — supplier device package listed as 1760-HBGA (45×45) — designed for surface-mount assembly.
• Temperature & Grade  Industrial grade operation from −40 °C to 100 °C for deployment in demanding thermal environments.
• Regulatory  RoHS compliant.

Typical Applications

• High-density FPGA designs — Systems that require large programmable logic capacity and significant on-chip memory resources can leverage the device’s 952,000 logic elements and ~53 Mbits of RAM.
• High-I/O systems — Applications needing extensive parallel interfaces or multiple peripheral connections can take advantage of the 600 available user I/O pins.
• Industrial embedded platforms — Industrial-temperature rated designs that require reliable operation from −40 °C to 100 °C can use this device’s industrial grade specification and surface-mount package.

Unique Advantages

• High logic capacity: 952,000 logic elements provide the scale to implement complex FPGA-based algorithms and large custom logic blocks.
• Substantial on-chip memory: Approximately 53 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage.
• Large I/O footprint: 600 user I/O pins support extensive interfacing without increasing board-level complexity.
• Industrial temperature range: Rated for −40 °C to 100 °C operation, suitable for a wide range of fielded equipment.
• Compact surface-mount package: 1760-BBGA (supplier 1760-HBGA, 45×45) helps keep PCB area efficient while enabling high-density routing.
• RoHS compliant: Conforms to RoHS requirements for environmental compliance.

Why Choose 5SGXMBBR2H43I2LN?

The 5SGXMBBR2H43I2LN positions itself for designs that demand large programmable fabric, significant on-chip RAM, and a high I/O count within an industrial temperature-rated, surface-mount package. Its combination of 952,000 logic elements, approximately 53 Mbits of embedded memory, and 600 I/Os provides a balanced platform for complex, high‑integration FPGA implementations.

Engineers and procurement teams seeking a robust, RoHS-compliant FPGA with clear electrical and thermal specifications will find this Stratix V GX device suitable for high-density embedded systems and industrial applications where logic capacity, memory, and I/O scale are primary selection criteria.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the 5SGXMBBR2H43I2LN.