5SGXMBBR2H43C3G

The 5SGXMBBR2H43C3G is a Stratix® V GX field-programmable gate array (FPGA) from Intel, provided in a 1760‑BBGA (FCBGA) surface-mount package. It combines very large programmable logic capacity with substantial on‑chip memory and a high I/O count to support complex digital designs.

With 952,000 logic elements and approximately 53.25 Mbits of embedded memory, this commercial-grade FPGA is targeted at designs that require dense logic integration, significant embedded memory resources, and extensive external interfacing within a 0 °C to 85 °C operating window.

Key Features

• Core Logic Capacity  952,000 logic elements (logic cells) for implementing large-scale digital logic and algorithm acceleration.
• Embedded Memory  Approximately 53.25 Mbits of on‑chip RAM to support data buffering, look‑up tables, and memory‑intensive functions without relying on external memory.
• I/O Density  600 user I/Os to enable broad external connectivity and multi‑channel interfaces.
• Package and Mounting  1760‑BBGA (FCBGA) package; supplier device package listed as 1760‑HBGA (45×45). Surface‑mount mounting type for board‑level integration.
• Power  Core supply voltage range 820 mV to 880 mV to match system power budgeting and core voltage requirements.
• Temperature Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for environmental and regulatory conformity.

Typical Applications

• High‑density digital processing  Use the large logic element count and embedded RAM for complex signal processing, algorithm acceleration, and custom compute blocks.
• Multi‑channel interface bridging  The 600 I/Os allow aggregation and bridging of multiple external interfaces and peripherals on a single device.
• System integration and prototyping  The combination of high logic capacity and on‑chip memory supports system‑level integration and hardware validation in commercial temperature environments.

Unique Advantages

• Highly integrated logic and memory: 952,000 logic elements paired with approximately 53.25 Mbits of embedded memory reduce dependency on external components and simplify board-level design.
• Extensive external connectivity: 600 I/Os provide flexibility for complex multi‑interface systems and dense routing requirements.
• Compact, production-ready package: 1760‑BBGA (FCBGA) / 1760‑HBGA (45×45) packaging in a surface‑mount form factor supports high‑density PCB layouts.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation for deployment in standard commercial applications.
• Controlled core voltage range: Core supply of 820 mV to 880 mV enables predictable power design and supply sequencing.
• Regulatory readiness: RoHS compliance for alignment with environmental requirements.

Why Choose 5SGXMBBR2H43C3G?

The 5SGXMBBR2H43C3G delivers a combination of very large programmable logic capacity, substantial embedded memory, and a high I/O count within a compact 1760‑BBGA package—making it well suited for commercial designs that require dense integration of logic and memory with extensive external interfacing. As a Stratix® V GX device from Intel, it is documented within the Stratix V device datasheet covering electrical and switching characteristics to support design and system integration.

This part is appropriate for teams building complex digital systems, multi‑interface platforms, or hardware prototypes that benefit from significant on‑chip resources and a commercial temperature rating. Its specification set supports scalable designs where logic density, embedded RAM, and I/O availability are primary requirements.

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