5SGXMBBR2H43C3N

The 5SGXMBBR2H43C3N is a Stratix V GX family FPGA from Intel, delivered in a 1760-ball BGA package for surface-mount assembly. It provides a large programmable fabric with 952,000 logic elements, approximately 53.25 Mbits of embedded memory, and up to 600 general-purpose I/O pins for demanding digital designs.

Specified for commercial applications, this device operates from a core supply between 820 mV and 880 mV and across a 0 °C to 85 °C temperature range, offering a high-density integration option in systems requiring extensive on-chip logic and memory resources.

Key Features

• FPGA Family: Stratix V GX architecture in a high-density FPGA package, intended for complex programmable logic implementations.
• Logic Capacity: 952,000 logic elements to implement large-scale digital functions and custom logic networks.
• Embedded Memory: Approximately 53.25 Mbits of on-chip RAM to support data buffering, LUTs, and state storage within the FPGA fabric.
• High I/O Count: Up to 600 I/O pins to interface with wide parallel buses, large peripheral sets, or multi-channel I/O requirements.
• Package & Mounting: 1760-BBGA FCBGA package (supplier package listed as 1760-HBGA, 45×45) with surface-mount mounting for compact board integration.
• Power Requirements: Core voltage supply range of 820 mV to 880 mV for power planning and regulator selection.
• Commercial Temperature Grade: Rated for operation from 0 °C to 85 °C for standard commercial environments.
• Environmental Compliance: RoHS compliant.

Typical Applications

• Complex digital systems: Use where large programmable logic capacity and abundant on-chip RAM are required to consolidate multiple functions into a single device.
• High-pin-count designs: Suitable for designs that require up to 600 I/O for broad interfacing with peripherals, memory, or multi-lane signaling (as supported by board-level design).
• Embedded memory–intensive functions: Ideal when substantial on-chip RAM (approximately 53.25 Mbits) is needed for buffering, packet handling, or large state machines.

Unique Advantages

• Large logic fabric: 952,000 logic elements let designers implement extensive custom logic without partitioning across multiple devices.
• Substantial embedded memory: Approximately 53.25 Mbits of on-chip RAM reduces dependence on external memory for many designs.
• Extensive I/O availability: Up to 600 I/O pins provide flexibility for interfacing and parallel connectivity on complex PCBs.
• Compact BGA footprint: 1760-ball BGA (45×45 supplier package) supports high-density board layouts while keeping signal routing manageable.
• Commercial temperature rating: 0 °C to 85 °C rating aligns the device with standard commercial electronics deployments.
• Regulatory compliance: RoHS-compliant manufacturing supports environmentally conscious product designs.

Why Choose 5SGXMBBR2H43C3N?

The 5SGXMBBR2H43C3N delivers a high-capacity Stratix V GX FPGA option for engineers who need extensive programmable logic, significant on-chip memory, and a high I/O count in a compact BGA package. Its commercial temperature rating and RoHS compliance make it suitable for mainstream embedded and enterprise applications that require consolidated logic and memory resources on a single device.

This device is positioned for designs that demand scalable logic density and flexible I/O integration, with specifications that facilitate system-level power and thermal planning thanks to a defined core voltage range and package details.

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